MPC860DEZQ50D4 vs MPC860SRVR50D4R2 对比

详细并排对比 MPC860DEZQ50D4 出自 NXP Semiconductors 和 MPC860SRVR50D4R2 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860DEZQ50D4 MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 Nrnd
NXP Semiconductors
MPC860SRVR50D4R2 MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 - PowerQUICC MPC8xx 50MHz MPU, 357-BGA | NXP

MPC860SRVR50D4R2 ⚠ 最后一次采购

规格对比

参数 MPC860DEZQ50D4 MPC860SRVR50D4R2
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $24.95 $85.75
Processor Type MPC8xx PowerQUICC, 32-bit MPC8xx PowerQUICC, 32-Bit Power Architecture
Core Architecture Power Architecture (embedded) —
Core Frequency 50 MHz —
Communications Processor Module CPM with HDLC, Ethernet, PCMCIA, SCC Yes (RISC CPM with HDLC, Ethernet, UART)
Ethernet MAC 10/100 Mbps integrated —
HDLC/SDLC Channels Yes (multi-channel) —
PCMCIA Interface Yes —
Supply Voltage (I/O) 3.3 V —
封装 357-Ball PBGA (25x25 mm) 357-BGA (25 x 25 mm)
安装类型 Surface Mount (BGA) Surface Mount
工作温度 0 C to +95 C —
RoHS 状态 Contains Lead (legacy BGA) Compliant
Lead-Free Status Contains Lead —
Packaging Tray Tape & Reel (TR)
Sub-Brand Heritage Freescale / NXP PowerQUICC —
Core Count — 1
最大时钟频率 — 50 MHz
Operating Voltage — 3.3 V
工作温度范围 — 0 C to +95 C
Lead Free Status — Lead Free
Process Technology — 0.32 um CMOS
Ethernet Interfaces — 10/100 Mbps Fast Ethernet (FCC)
DMA Channels — 4
Series — MPC860

数据手册与资源

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