MPC885ZP66 vs MPC880ZP66 Comparison
Detailed side-by-side comparison of MPC885ZP66 by NXP Semiconductors and MPC880ZP66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC885ZP66 | MPC880ZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | — |
| Core Count | 1 | 1 core |
| Data Bus Width | 32 bit | — |
| Maximum Clock Frequency | 66 MHz | 66 MHz |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Package | 357-ball PBGA, 25 mm x 25 mm | — |
| Mounting Type | Surface Mount | Surface mount |
| Operating Temperature | 0 C to +95 C (commercial) | — |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| RoHS Status | Non-Compliant (legacy part) | RoHS |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Data Width | — | 32 bit |
| Supply Voltage | — | 3.3 V |
| Operating Temperature Range | — | 0 C to 95 C |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Thermal Resistance | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Supply Current | — | [DATA_NEEDED: operating supply current] |