MPC885ZP66 vs MPC880ZP66 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC885ZP66 sa pamamagitan ng NXP Semiconductors at MPC880ZP66 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MPC885ZP66 | MPC880ZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | — |
| Core Count | 1 | 1 core |
| Width ng Data Bus | 32 bit | — |
| Maksimum na Taktiko ng Oras | 66 MHz | 66 MHz |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Packhaging | 357-ball PBGA, 25 mm x 25 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface mount |
| Temperature na Operasyon | 0 C to +95 C (commercial) | — |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| Tindminan RoHS | Non-Compliant (legacy part) | RoHS |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Data Width | — | 32 bit |
| Volte ng Pagbibigay | — | 3.3 V |
| Hanay ng Temperature na Operasyon | — | 0 C to 95 C |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Thermal Resistance | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Kuru-kuryente ng Pagbibigay | — | [DATA_NEEDED: operating supply current] |