MPC885ZP66 vs MPC880ZP66 比較

詳細並排比較 MPC885ZP66 由 NXP Semiconductors 與 MPC880ZP66 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC885ZP66 MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 ✓ 啟用中
NXP Semiconductors
MPC880ZP66 MPC880ZP66 - 66MHz 32-Bit PowerQUICC MPU | NXP

MPC880ZP66 - 66MHz 32-Bit PowerQUICC MPU | NXP

MPC880ZP66 Obsolete

規格比較

參數 MPC885ZP66 MPC880ZP66
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Product Category Microprocessors (MPU) —
Processor Series PowerQUICC MPC8xx —
Core Architecture Power Architecture —
Core Count 1 1 core
資料匯流排寬度 32 bit —
最大時脈頻率 66 MHz 66 MHz
Instruction Cache 4 KB —
Data Cache 4 KB —
封裝 357-ball PBGA, 25 mm x 25 mm —
安裝類型 Surface Mount Surface mount
工作溫度 0 C to +95 C (commercial) —
I/O Supply Voltage 3.3 V —
Core Supply Voltage 1.8 V —
Integrated Peripherals Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART —
Memory Controller SDRAM, DRAM, SRAM, Flash, ROM —
RoHS 狀態 Non-Compliant (legacy part) RoHS
Processor Type — MPC8xx PowerQUICC communications microprocessor
Architecture — Power Architecture
Data Width — 32 bit
供應電壓 — 3.3 V
工作溫度範圍 — 0 C to 95 C
Package Type — 357-PBGA (25 x 25 mm)
Package Pin Count — 357 pins
Packaging — Tray
Lead-Free Status — Contains Lead
Output Current — [DATA_NEEDED: processor output current specification]
Internal Memory — [DATA_NEEDED: internal memory configuration]
External Memory Interface — [DATA_NEEDED: external memory interface details]
Communications Peripherals — [DATA_NEEDED: communications peripheral list]
Maximum Power Dissipation — [DATA_NEEDED: maximum power dissipation]
熱阻 — [DATA_NEEDED: junction-to-ambient thermal resistance]
供應電流 — [DATA_NEEDED: operating supply current]

資料表與資源

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