MPC885ZP66 vs MPC880ZP66 Vergleich
Detaillierter Direktvergleich von MPC885ZP66 von NXP Semiconductors und MPC880ZP66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC885ZP66 | MPC880ZP66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | — |
| Core Count | 1 | 1 core |
| Datenbusbreite | 32 bit | — |
| Maximale Taktfrequenz | 66 MHz | 66 MHz |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Gehäuse | 357-ball PBGA, 25 mm x 25 mm | — |
| Montageart | Surface Mount | Surface mount |
| Betriebstemperatur | 0 C to +95 C (commercial) | — |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| RoHS-Status | Non-Compliant (legacy part) | RoHS |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Data Width | — | 32 bit |
| Versorgungsspannung | — | 3.3 V |
| Betriebstemperaturbereich | — | 0 C to 95 C |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Versorgungsstrom | — | [DATA_NEEDED: operating supply current] |