MPC885ZP66 vs MPC880ZP66 Comparación
Comparación detallada lado a lado de MPC885ZP66 por NXP Semiconductors y MPC880ZP66 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC885ZP66 | MPC880ZP66 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture | — |
| Core Count | 1 | 1 core |
| Ancho del bus de datos | 32 bit | — |
| Frecuencia de reloj máxima | 66 MHz | 66 MHz |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Encapsulado | 357-ball PBGA, 25 mm x 25 mm | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Temperatura de funcionamiento | 0 C to +95 C (commercial) | — |
| I/O Supply Voltage | 3.3 V | — |
| Core Supply Voltage | 1.8 V | — |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART | — |
| Memory Controller | SDRAM, DRAM, SRAM, Flash, ROM | — |
| Estado RoHS | Non-Compliant (legacy part) | RoHS |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Data Width | — | 32 bit |
| Tensión de alimentación | — | 3.3 V |
| Rango de temperatura de funcionamiento | — | 0 C to 95 C |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Resistencia térmica | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Corriente de alimentación | — | [DATA_NEEDED: operating supply current] |