MT40A512M16TB-062E:R vs K4A8G085WB-BIWE Comparison

Detailed side-by-side comparison of MT40A512M16TB-062E:R by Micron Technology and K4A8G085WB-BIWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M16TB-062E:R MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R ✓ Active
Samsung Electronics
K4A8G085WB-BIWE K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung

K4A8G085WB-BIWE ✓ Active

Specification Comparison

Parameter MT40A512M16TB-062E:R K4A8G085WB-BIWE
Brand Micron Technology Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $60.00 $6.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit (512M x 16) 8 Gb
Data Rate 3200 MT/s 3200 Mbps
Clock Frequency 1600 MHz —
CAS Latency 22 [DATA_NEEDED: CL value]
Supply Voltage (VDD/VDDQ) 1.2V ±60mV —
VPP Voltage 2.5V (-125mV, +250mV) —
Operating Temperature 0°C to +95°C 0°C to +85°C
Package 96-FBGA (7.5x13 mm) 78-FBGA
Interface Parallel —
Data Bus Width 16 bits —
Refresh Time 8192 cycles (64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C) —
I/O Type 1.2V pseudo open-drain —
Features Auto self-refresh, auto precharge, write leveling, CRC, dynamic on-chip termination, ZQ calibration —
RoHS Status Compliant Compliant
Memory Organization — 1G x 8
Supply Voltage — 1.2 V
Mounting Type — Surface Mount
Memory Interface — Parallel
Access Time — [DATA_NEEDED: tRCD, tRP, tRAS]
Refresh — Auto-refresh, self-refresh
Lead-Free — Yes
Halogen Free — Yes

Datasheets & Resources

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