MT41K256M16HA-15EM:E vs H5TC4G63MFR-PBA Comparison

Detailed side-by-side comparison of MT41K256M16HA-15EM:E by Micron Technology and H5TC4G63MFR-PBA by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT41K256M16HA-15EM:E MT41K256M16HA-15EM:E - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16HA-15EM:E - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16HA-15EM:E ✓ Active
SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ Active

Specification Comparison

Parameter MT41K256M16HA-15EM:E H5TC4G63MFR-PBA
Brand Micron Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $5.95 $6.50
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gbit 4 Gb
Organization 256M x 16 256M x 16
Supply Voltage 1.35 V (1.5V compatible) —
Data Rate 1333 Mbps (DDR3L-1333) 1866 Mbps (PC3L-14900)
CAS Latency 15 —
Package 96-ball FBGA (9x14mm) 96-ball FBGA
Mounting Type Surface Mount —
Operating Temperature [DATA_NEEDED: operating temperature range] —
RoHS Status Compliant —
Lead-Free Yes —
Number of Pins 96 —
Access Time 13.75 ns —
Clock Frequency 800 MHz —
Interface Parallel —
Supply Voltage (VDD/VDDQ) — 1.35V (+0.100V/-0.067V)
Number of Banks — 8
Burst Length — BL8, BL4 (with burst chop)
CAS Latency (CL) — Programmable
CAS Write Latency (CWL) — Programmable
Additive Latency — Programmable
On-Die Termination (ODT) — Yes
ZQ Calibration — Yes
Write Leveling — Yes
Auto Self-Refresh — Yes
Temperature-Compensated Self-Refresh — Yes
Process Technology — 30nm-class
RoHS Compliant — Yes (Lead-Free & Halogen-Free)

Datasheets & Resources

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