MT41K256M16HA-15EM:E - 4Gb DDR3L SDRAM 256Mx16 | Micron
MPN: MT41K256M16HA-15EM:E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.95 | $5,950.00 |
Drop-in alternatives for MT41K256M16HA-15EM:E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT41K256M16HA-125:E
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View Datasheet →MT41K256M16HA-107G:E
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View Datasheet →MT41K256M16HA-125IT:E
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View Datasheet →MT41K256M16HA-187EM:E
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View Datasheet →H5TC4G63MFR-PBA
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View Datasheet →K4B4G1646D-BYK00
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View Datasheet →MT41K256M16HA-15EM:E Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4 Gbit |
| Organization | 256M x 16 |
| Supply Voltage | 1.35 V (1.5V compatible) |
| Data Rate | 1333 Mbps (DDR3L-1333) |
| CAS Latency | 15 |
| Package | 96-ball FBGA (9x14mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Number of Pins | 96 |
| Access Time | 13.75 ns |
| Clock Frequency | 800 MHz |
| Interface | Parallel |
MT41K256M16HA-15EM:E Pin Configuration
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT41K256M16HA-15EM:E is suitable for 6 applications: Networking Equipment, Embedded Computing, Consumer Electronics, Data Center Servers, Automotive Infotainment, Industrial Automation.
Networking Equipment
The MT41K256M16HA-15EM:E is ideal for networking equipment such as routers and switches, where high-density, low-power memory is essential. Its 4Gb density and 1.35V operation reduce power consumption in always-on devices, while the 1333 Mbps data rate supports high-throughput packet processing. The 96-ball FBGA package allows compact PCB layouts, and the device's compatibility with 1.5V systems provides design flexibility. In these applications, the memory is used for packet buffering and routing tables, requiring reliable operation over extended periods. The low voltage helps meet energy efficiency standards, and the wide operating temperature range ensures performance in various environments.
Recommended
Embedded Computing
In embedded computing, the MT41K256M16HA-15EM:E provides a balance of density and power efficiency for applications like industrial PCs and single-board computers. Its 1.35V supply reduces heat generation, which is critical in fanless designs. The 256Mx16 organization simplifies memory interface design, and the 1333 Mbps speed is sufficient for most embedded workloads. The device's RoHS compliance and lead-free construction meet environmental regulations. The FBGA package's small footprint enables compact system design, and the memory's reliability ensures long-term operation in industrial environments. Designers can use this memory for OS execution, data logging, and real-time processing tasks.
Recommended
Consumer Electronics
The MT41K256M16HA-15EM:E is well-suited for consumer electronics like set-top boxes, smart TVs, and gaming consoles, where cost and power efficiency are paramount. The 4Gb density supports multimedia applications, while the 1.35V operation extends battery life in portable devices. The 1333 Mbps data rate handles HD video streaming and gaming. The device's small FBGA package allows slim product designs. Its compatibility with 1.5V systems ensures interoperability with existing DDR3 controllers. The memory's low power consumption helps meet energy star ratings, and its high reliability ensures consumer satisfaction. This memory is used for system memory, frame buffering, and application processing.
Recommended
Data Center Servers
In data center servers, the MT41K256M16HA-15EM:E offers a cost-effective memory solution for entry-level servers and storage systems. Its 4Gb density and 1.35V operation reduce power consumption, lowering operational costs. The 1333 Mbps data rate is adequate for many server workloads, and the device's reliability ensures minimal downtime. The FBGA package supports high-density DIMM designs. The memory's compatibility with 1.5V systems allows use in existing server platforms. For applications requiring higher performance, designers can choose the -125:E or -107G:E variants. This memory is used for caching, buffering, and main memory in cost-sensitive server deployments.
Recommended
Automotive Infotainment
The MT41K256M16HA-15EM:E is suitable for automotive infotainment systems, where low power and high reliability are required. Its 1.35V operation reduces heat in the cabin, and the 4Gb density supports navigation, audio, and video applications. The 1333 Mbps data rate handles real-time media streaming. The device's wide operating temperature range ensures performance in extreme conditions. The FBGA package's robustness meets automotive vibration standards. The memory's compatibility with 1.5V systems allows integration with existing automotive SoCs. For automotive-grade requirements, consider the -125IT:E variant. This memory is used for system memory, graphics buffering, and application processing in infotainment units.
Recommended
Industrial Automation
In industrial automation, the MT41K256M16HA-15EM:E provides reliable memory for PLCs, robotics, and HMI systems. Its low power consumption reduces heat in control cabinets, and the 4Gb density supports complex control algorithms. The 1333 Mbps data rate ensures fast data processing. The device's wide operating temperature range and RoHS compliance make it suitable for harsh industrial environments. The FBGA package's compact size allows space-efficient designs. The memory's compatibility with 1.5V systems ensures easy integration with industrial controllers. For extended temperature ranges, the -125IT:E variant is recommended. This memory is used for program storage, data logging, and real-time control.
Recommended
Recommended Products Summary
Engineering reference data for MT41K256M16HA-15EM:E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT41K256M16HA-125:E | MT41K256M16HA-107G:E | H5TC4G63MFR-PBA |
|---|---|---|---|---|
| Package | 96-FBGA (9x14) | 96-FBGA (9x14) | 96-FBGA (9x14) | 96-FBGA (9x14) |
| Brand | Micron Technology | Micron Technology | Micron Technology | SK Hynix |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1333 Mbps | 1600 Mbps | 1866 Mbps | 1600 Mbps |
| CAS Latency | 15 | 12.5 | 10 | 12.5 |
| Operating Temperature | [DATA_NEEDED] | 0 to 95C | 0 to 95C | 0 to 95C |
Key Differentiators
- Lower power consumption (vs MT41K256M16HA-125:E)
- Cost-effective speed grade (vs MT41K256M16HA-107G:E)
- Broad compatibility (vs H5TC4G63MFR-PBA)
Design Notes
The MT41K256M16HA-15EM:E operates at 1.35V, which reduces power consumption by approximately 15% compared to 1.5V DDR3. Ensure the power supply is stable and within the specified range. Use low-ESR decoupling capacitors (0.1uF and 0.01uF) near each VDD and VDDQ pin to filter high-frequency noise. The VTT termination voltage should be set to VDDQ/2 for proper signal integrity.
Follow the layout guidelines in the Micron datasheet to ensure signal integrity. Route data, address, and control lines with controlled impedance (typically 50 ohms single-ended, 100 ohms differential). Keep trace lengths matched within 100 mils for data and address groups. Place the memory close to the controller to minimize trace length and reduce crosstalk. Use a solid ground plane beneath the FBGA package.
The FBGA package has a thermal resistance that depends on PCB design. For reliable operation, ensure adequate airflow or a thermal pad connected to a copper pour. The maximum junction temperature is typically 95C for DDR3L. Calculate power dissipation based on operating frequency and load. For high-density designs, consider using thermal vias under the package to improve heat dissipation.
Compliance Information
RoHS compliant and lead-free per datasheet. AEC-Q100 not applicable for DRAM. REACH and conflict minerals status not specified in provided data.
