NT5CC256M16DP-DI vs H5TC4G63AFR-PBA Comparison

Detailed side-by-side comparison of NT5CC256M16DP-DI by Nanya Technology and H5TC4G63AFR-PBA by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Nanya Technology
NT5CC256M16DP-DI

NT5CC256M16DP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya

NT5CC256M16DP-DI βœ“ Active
SK hynix
H5TC4G63AFR-PBA H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA βœ“ Active

Specification Comparison

Parameter NT5CC256M16DP-DI H5TC4G63AFR-PBA
Brand Nanya Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.50 $3.98
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4Gb 4Gb
Organization 256M x 16 256M x 16
Supply Voltage 1.35V β€”
Data Rate 1600 Mbps/pin (800MHz) 1866 Mbps (PC3L-14900)
Package VFBGA-96 96-ball FBGA
Operating Temperature Range -40Β°C to +95Β°C (industrial) 0Β°C to +95Β°C (Tcase)
CAS Latency 11, 12, 13 (programmable) β€”
Burst Length 8, 4 (with burst chop) 8 and 4 (with burst chop)
Number of Banks 8 8
Interface Differential clock (CK, CK#) 16-bit I/O
Refresh Auto-refresh and self-refresh β€”
On-Die Termination Yes (ODT) β€”
RoHS Compliant Compliant
Lead-Free Yes β€”
Supply Voltage (VDD/VDDQ) β€” 1.35V
Ball Pitch β€” 0.8mm
CAS Latency (CL) β€” 11, 12, 13
On-Die Termination (ODT) β€” Yes
ZQ Calibration β€” Yes
Write Leveling β€” Yes
Auto Self-Refresh β€” Yes
Partial Array Self-Refresh β€” Yes

Datasheets & Resources

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