S9S08AW16AE0MLC vs MC9S08GT16CFBE Comparison

Detailed side-by-side comparison of S9S08AW16AE0MLC by NXP Semiconductors and MC9S08GT16CFBE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08AW16AE0MLC S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP

S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP

S9S08AW16AE0MLC ✓ Active
NXP Semiconductors
MC9S08GT16CFBE MC9S08GT16CFBE - 8-Bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08GT16CFBE - 8-Bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08GT16CFBE Obsolete

Specification Comparison

Parameter S9S08AW16AE0MLC MC9S08GT16CFBE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $3.29 $4.65
Core HCS08 (enhanced HC08) 8-bit —
CPU Frequency 40 MHz (20 MHz internal bus) —
Program Flash 16 KB —
RAM 1 KB 2 KB
CAN Module MSCAN (CAN 2.0 A/B) —
ADC 10-bit, 8-channel —
Timers/PWM 6-channel 16-bit —
Communication Interfaces 2x SCI (UART), 1x SPI, 1x I2C I2C, SCI, SPI
GPIO (max) 27 —
Supply Voltage 2.7 V to 5.5 V 2.5 V / 3.3 V
Operating Temperature -40 C to +125 C (automotive AEC-Q100) [DATA_NEEDED: operating temperature range]
Package 32-pin LQFP, 7 x 7 mm 44-QFP (10x10 mm)
Mounting Type Surface Mount (gull-wing) Surface Mount
Debug Interface Single-wire BDM (background debug mode) —
Instruction Set HC08 with BGND extension —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-Bit
Maximum Bus Frequency — 40 MHz
Flash Memory — 16 KB (16K x 8)
EEPROM — None (Flash-based)
ADC Resolution — 10-bit (8 channels)
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 36
Packaging — Tray
RoHS Status — [DATA_NEEDED: RoHS status]

Datasheets & Resources

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