S9S08AW16AE0MLC vs MC9S08GT16CFBE 对比

详细并排对比 S9S08AW16AE0MLC 出自 NXP Semiconductors 和 MC9S08GT16CFBE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW16AE0MLC S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP

S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP

S9S08AW16AE0MLC ✓ 量产中
NXP Semiconductors
MC9S08GT16CFBE MC9S08GT16CFBE - 8-Bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08GT16CFBE - 8-Bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08GT16CFBE Obsolete

规格对比

参数 S9S08AW16AE0MLC MC9S08GT16CFBE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $3.29 $4.65
Core HCS08 (enhanced HC08) 8-bit —
CPU Frequency 40 MHz (20 MHz internal bus) —
Program Flash 16 KB —
RAM 1 KB 2 KB
CAN Module MSCAN (CAN 2.0 A/B) —
ADC 10-bit, 8-channel —
Timers/PWM 6-channel 16-bit —
Communication Interfaces 2x SCI (UART), 1x SPI, 1x I2C I2C, SCI, SPI
GPIO (max) 27 —
电源电压 2.7 V to 5.5 V 2.5 V / 3.3 V
工作温度 -40 C to +125 C (automotive AEC-Q100) [DATA_NEEDED: operating temperature range]
封装 32-pin LQFP, 7 x 7 mm 44-QFP (10x10 mm)
安装类型 Surface Mount (gull-wing) Surface Mount
Debug Interface Single-wire BDM (background debug mode) —
Instruction Set HC08 with BGND extension —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-Bit
Maximum Bus Frequency — 40 MHz
Flash Memory — 16 KB (16K x 8)
EEPROM — None (Flash-based)
ADC Resolution — 10-bit (8 channels)
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 36
Packaging — Tray
RoHS 状态 — [DATA_NEEDED: RoHS status]

数据手册与资源

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