S9S08AW16AE0MLC vs MC9S08GT16CFBE Comparación
Comparación detallada lado a lado de S9S08AW16AE0MLC por NXP Semiconductors y MC9S08GT16CFBE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP
S9S08AW16AE0MLC ✓ Activo
Comparación de especificaciones
| Parámetro | S9S08AW16AE0MLC | MC9S08GT16CFBE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,29 | $4,65 |
| Core | HCS08 (enhanced HC08) 8-bit | — |
| CPU Frequency | 40 MHz (20 MHz internal bus) | — |
| Program Flash | 16 KB | — |
| RAM | 1 KB | 2 KB |
| CAN Module | MSCAN (CAN 2.0 A/B) | — |
| ADC | 10-bit, 8-channel | — |
| Timers/PWM | 6-channel 16-bit | — |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x I2C | I2C, SCI, SPI |
| GPIO (max) | 27 | — |
| Tensión de alimentación | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| Temperatura de funcionamiento | -40 C to +125 C (automotive AEC-Q100) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 32-pin LQFP, 7 x 7 mm | 44-QFP (10x10 mm) |
| Tipo de montaje | Surface Mount (gull-wing) | Surface Mount |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum Bus Frequency | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| EEPROM | — | None (Flash-based) |
| ADC Resolution | — | 10-bit (8 channels) |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 36 |
| Packaging | — | Tray |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |