5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
Teilenummer: 5CSEBA4U23C6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $138.33 | $138,33 |
| 10 | $128.5 | $1.285,00 |
| 100 | $112.75 | $11.275,00 |
| 500 | $98.4 | $49.200,00 |
| 1.000 | $86.2 | $86.200,00 |
5CSEBA4U23C6N Übersicht
Cyclone V SE SoC devices are heterogeneous compute platforms that combine a hard processor system (HPS) with a programmable logic fabric. The HPS contains a dual-core ARM Cortex-A9 MPCore CPU cluster running up to 925 MHz, L1 caches per core, a shared 512 KB L2 cache, NEON media engine, single-precision/double-precision floating-point unit, CoreSight debug and trace, and a rich set of peripherals including DDR3/DDR3L/LPDDR2 controllers, USB 2.0, gigabit Ethernet MAC, CAN, SPI, I2C, UART, and SD/MMC. The FPGA side delivers up to 40,000 logic elements, 224 18x18 multipliers, and 2,460 Kbits of embedded memory, enabling custom acceleration pipelines alongside the CPU subsystem. This positions the part as a low-power, mid-density SoC for embedded vision, motor control, industrial IoT gateways, and protocol-bridging equipment.
The Cyclone V SE family uses Altera's Adaptive Logic Module (ALM) architecture with 8-input fracturable look-up tables, 10 Kbits of MLAB memory per ALM pair, and variable-precision DSP blocks. Transceivers are not integrated on the SE device (those reside on Cyclone V SX/ST/E/GX/T); the SE focuses on logic-density-to-power-efficiency for cost-sensitive applications that still need HPS integration. The 5CSEBA4U23C6N variant (5CSEBA4 in the U23 package) is the 40K-LE member of the U23 family. Configuration is through industry-standard JTAG (IEEE 1149.1) or Active Serial (AS) configuration via Altera/Intel EPCS or EPCQ flash devices.
Typical applications include industrial machine vision, motor control and industrial drives, factory-automation PLCs, smart-grid substation equipment, medical imaging preprocessing, defense SDR front ends, and automotive infotainment prototypes. The HPS offloads Linux/Android OS and TCP/IP stacks while the FPGA fabric accelerates pixel processing, FFTs, or deterministic I/O. The 672-pin UFBGA (23x23 mm, 0.8 mm pitch) is the largest UFBGA package in the Cyclone V SE family and exposes the full HPS peripheral set plus 188 general-purpose FPGA I/Os.
When designing with this part, allocate at least four PCB layers with a continuous ground plane under the UFBGA, follow Intel's pinout guidelines for HPS DDR3 byte-lane matching, and provide independent decoupling on each VCC_HPS, VCC_IO, VCC_PLL, and VCC_FPGA rail. Quartus Prime or the older Quartus II software is required for synthesis, place-and-route, and HPS configuration. Designers migrating from older Altera SoCs (Cyclone V SX/ST) should re-validate DDR3 timing closure because the SE device omits the transceiver block.
This page synthesizes distributor pricing, drop-in pin-compatible migration paths within the Cyclone V SE family, and practical HPS + FPGA design notes that go beyond the manufacturer datasheet's pin tables alone.
Drop-in-Alternativen für 5CSEBA4U23C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA4U23C6N (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Operating Temperature, Speed Grade, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA6U23C6N
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA5U23C6N
✅ Drop-In✓ Auf Lager
$122.33 / Stück
Datenblatt ansehen →5CSEBA2U23C6N
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →5CSEBA4U23A7N
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA4U23C7N
✅ Drop-In✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →5CSEBA4U23C8N
✅ Drop-In✓ Auf Lager
$138.2 / Stück
Datenblatt ansehen →5CSEBA4U23C6N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (M10K + MLAB) | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | 112 |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | 925 MHz |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR2 |
| Process Technology | TSMC 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| General-Purpose FPGA I/Os | 188 |
| Transceivers | Not integrated on SE device |
| Gehäuse | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Montageart | Surface Mount (BGA) |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |
| RoHS-Status | Compliant |
5CSEBA4U23C6N 672-pin ufbga / ubga, 23 x 23 mm, 0.8 mm pitch Pinbelegungsleitfaden
Pinbelegung für 5CSEBA4U23C6N (672-pin ufbga / ubga, 23 x 23 mm, 0.8 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA4U23C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA4U23C6N ist geeignet für 6 Anwendungs: Industrial Machine Vision, Motor Control and Industrial Drives, Industrial IoT Gateway and Protocol Bridge, Medical Imaging Pre-Processing, Defense and SDR Front-End, Automotive Infotainment Prototyping.
Industrial Machine Vision
The 5CSEBA4U23C6N is well matched to industrial machine vision because the FPGA fabric delivers 224 18x18 multipliers and 2,460 Kbits of embedded memory, enabling real-time Bayer demosaicing, Sobel/edge detection, and CNN inference acceleration. The dual ARM Cortex-A9 cores at 925 MHz run the GigE Vision, USB3 Vision, or GenICam host stack and TCP/IP networking. With 188 general-purpose I/Os, the 672-ball UFBGA exposes parallel CMOS camera interfaces, machine-light strobe triggers, and LVDS lines for area-scan cameras. Compared to a discrete CPU+FPGA board, the integrated HPS reduces board area, BOM, and PCIe/cable latency between processors, which matters for high-frame-rate sorting and inspection lines.
Empfohlen
Motor Control and Industrial Drives
The 5CSEBA4U23C6N is ideal for multi-axis motor drives and servo controllers because the FPGA fabric implements deterministic PWM, encoder (EnDat, BISS, SSI) interfaces, and field-oriented control loops with sub-microsecond latency, while the dual Cortex-A9 at 925 MHz runs EtherCAT, PROFINET, or CANopen master stacks. The 672-ball UFBGA provides enough LVDS pairs and 3.3 V tolerant I/O for resolver-to-digital converters, gate-driver fault inputs, and brake control. The 28 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures. Designers migrating from separate DSP+MCU boards benefit from collapsing two ICs and a bus bridge into a single SoC FPGA, cutting PCB area by roughly 40%.
Empfohlen
Industrial IoT Gateway and Protocol Bridge
The 5CSEBA4U23C6N fits IIoT gateways because the dual Cortex-A9 HPS runs Linux with TCP/IP, MQTT, and OPC-UA stacks while the FPGA fabric terminates legacy fieldbuses (Modbus RTU, PROFIBUS, DeviceNet, RS-485) that cannot be handled by the host CPU alone. The HPS gigabit Ethernet MAC, USB 2.0, and CAN interfaces give multi-protocol connectivity, and the 40K logic elements are sufficient for deterministic protocol decode, CRC, and timestamping. With 188 I/Os, the 672-ball UFBGA connects directly to RS-485 transceivers, opto-isolated digital inputs, and 4-20 mA analog front-ends. Compared to a CPU-only gateway, adding the FPGA fabric offloads the CPU from hard real-time polling, eliminating jitter on critical control loops.
Empfohlen
Medical Imaging Pre-Processing
The 5CSEBA4U23C6N suits medical imaging preprocessing such as ultrasound beamforming, endoscopy pixel pipelines, and patient-monitoring DSP front ends. The FPGA fabric's 224 18x18 multipliers accelerate FIR filters, Hilbert transforms, and envelope detection at line rate, while the dual Cortex-A9 runs the higher-level user interface, network protocols (DICOM, HL7), and storage stack. The HPS DDR3 controller hosts large frame buffers for raw ultrasound or video streams, and the 1.1 V core plus 28 nm process keeps dissipation low enough for portable cart-mounted equipment. Designers benefit from a single-CPU+FPGA solution that simplifies IEC 62304 software classification and reduces the supplier count for FDA documentation.
Empfohlen
Defense and SDR Front-End
The 5CSEBA4U23C6N is a practical base for software-defined radio front ends where the FPGA side implements DDC/DUC, channelizers, and cryptography, while the dual ARM Cortex-A9 cores run the waveform, link-layer protocol, and network stack. The 672-ball UFBGA exposes enough LVDS pairs to interface with high-speed ADCs and DACs in direct-conversion radios, and the HPS gigabit Ethernet MAC delivers digitized IF to a host processor or network. Compared to ASIC-based radios, the Cyclone V SE allows mid-program reprogramming for new waveforms without respinning silicon. The SE device omits transceivers, so designers add an external RF front-end or pair the SoC with a Cyclone V GT/SX device if high-speed serial links are required.
Empfohlen
Automotive Infotainment Prototyping
The 5CSEBA4U23C6N supports automotive infotainment prototyping where the HPS runs Linux/Android Automotive, MOST or Ethernet AVB audio-video bridging, and the FPGA fabric accelerates display composition, video scaling, and MIPI CSI-2 virtual-channel demuxing. The 188 FPGA I/Os handle LVDS display panels, touch controllers, and rear-camera inputs simultaneously, while the HPS USB 2.0, SD/MMC, and CAN interfaces link to the rest of the vehicle network. Compared to discrete CPU+FPGA prototypes, integrating the HPS into the same package simplifies PCB routing for high-speed display buses and reduces BOM cost. For production automotive programs, designers migrate to the Q100-qualified Cyclone V SE -A7N part.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA4U23C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA6U23C6N | 5CSEBA5U23C6N | 5CSEBA2U23C6N | 5CSEBA4U23A7N | 5CSEBA4U23C8N |
|---|---|---|---|---|---|---|
| Package | 672-pin UFBGA (U23, 23x23 mm, 0.8 mm pitch) | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same | 672-pin UFBGA (U23, 23x23 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 40,000 | 110,000 | 85,000 | 25,000 | 40,000 | 40,000 |
| HPS CPU Cores | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz |
| Embedded Memory | 2,460 Kbits | 5,570 Kbits | 3,970 Kbits | 1,660 Kbits | 2,460 Kbits | 2,460 Kbits |
| DSP 18x18 Multipliers | 112 (224 18x18 multipliers) | 224 (448 18x18 multipliers) | 156 (312 18x18 multipliers) | 80 (160 18x18 multipliers) | 112 (224 18x18 multipliers) | 112 (224 18x18 multipliers) |
| Speed Grade | C6 (industrial) | C6 | C6 | C6 | A7 | C8 |
| Process Node | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
Wichtigste Unterscheidungsmerkmale
- Highest density option in the U23 BGA family with the same HPS block (vs. 5CSEBA2U23C6N)
- Mid-range cost-density sweet spot vs higher-density variants (vs. 5CSEBA6U23C6N)
- Pin-compatible migration path with speed-grade variants (vs. 5CSEBA4U23C8N)
Designhinweise
Estimated: the 672-pin UFBGA at 0.8 mm pitch requires at least a 4-layer PCB with a continuous ground plane directly under the package to control return paths for the HPS DDR3 byte lanes. Use microvia-in-pad construction (or 0.4 mm laser vias with tented pads) for the inner-row balls to escape BGA fan-out. Length-match HPS DDR3 byte lanes within +/- 25 mil and route each byte group on a single inner layer with reference to a continuous ground plane; this preserves signal integrity for DDR3-1600 operation.
Estimated: each of VCC_HPS, VCC_IO (per bank), VCC_PLL, and VCC_FPGA must have a dedicated 0.1 uF X7R decoupling capacitor within 2 mm of its supply ball, plus a 10 uF bulk capacitor per supply domain within 25 mm. The 1.1 V VCC rail typically draws 1-3 A at full HPS+FPGA utilization; size the regulator for at least 5 A headroom and place it within 50 mm of the UFBGA. A dedicated ferrite bead on the analog VCC_PLL rail improves HPS jitter margin.
Estimated: at 25 C ambient and 5 W dissipation in the 672-ball UFBGA with a 4-layer PCB and no heatsink, junction temperature rises roughly 25 C above ambient (theta_JA near 5 C/W). For sealed industrial enclosures with 65 C ambient, attach a 10x10 mm copper pad or a small 15 C/W heatsink to keep Tj below the 100 C industrial limit. Use Quartus Prime PowerPlay to obtain an accurate dissipation number before finalizing the thermal design.
Configure the 5CSEBA4U23C6N via Active Serial (AS) mode using an EPCQ256 or compatible 256-Mbit QSPI flash for production; JTAG mode is intended for development only. Hold nCONFIG low during power-up and ensure MSEL[2:0] are strapped to the AS mode (typically 000) before releasing nSTATUS. The HPS boots from the same flash using the dedicated SDM pins; verify pin-mux settings in Quartus Prime's HPS Platform Designer to avoid contention with FPGA I/O banks.
Compliance-Informationen
RoHS compliance per Intel Cyclone V SE product family documentation. Not AEC-Q100 qualified - choose automotive-grade SoC FPGA parts for vehicle programs. Halogen-free status not specified in verified web data.
