EP2SGX30DF780I7N vs EP2SGX30DF780I3N Vergleich

Detaillierter Direktvergleich von EP2SGX30DF780I7N von Intel und EP2SGX30DF780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX30DF780I7N EP2SGX30DF780I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $188,00 $171,00
Series Stratix II GX —
Family Stratix II GX (Enhanced Configuration / EPC) Stratix II GX
Logic Elements 33,880 LEs 33,880
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (bits) 1,369,728 bits —
Total RAM Blocks M512/M4K/M-RAM TriMatrix —
Embedded Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Maximum User I/O 586 user I/O pins —
Multi-Gigabit Transceivers (MGTs) Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps —
MGT Protocols Supported PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE —
Gehäuse 780-ball FineLine BGA 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch
Core Voltage 1.2 V (typical) —
Process Technology 90 nm 90 nm CMOS
Betriebstemperatur -40C to +100C (Industrial) —
Speed Grade 7 (fastest commercial speed grade) I3
Configuration Mode Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS compliance] Compliant
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Logic Cells — 33,380
Configurable Logic Blocks (CLBs) — 33,880
Total Memory Bits — 1,369,728
Maximum Core Frequency — 622.08 MHz
Core Supply Voltage — 1.2 V
User I/O Pins — 361
Operating Temperature Grade — Industrial
Lead Free — Yes

Datenblätter & Ressourcen

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