EP2SGX30DF780I7N vs EP2SGX30DF780I3N Сравнение
Подробное сравнение бок о бок EP2SGX30DF780I7N от Intel и EP2SGX30DF780I3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP2SGX30DF780I7N | EP2SGX30DF780I3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $188,00 | $171,00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX (Enhanced Configuration / EPC) | Stratix II GX |
| Logic Elements | 33,880 LEs | 33,880 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 1,369,728 bits | — |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| Maximum User I/O | 586 user I/O pins | — |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps | — |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE | — |
| Корпус | 780-ball FineLine BGA | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Core Voltage | 1.2 V (typical) | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Рабочая температура | -40C to +100C (Industrial) | — |
| Speed Grade | 7 (fastest commercial speed grade) | I3 |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Статус RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Уровень MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| Core Supply Voltage | — | 1.2 V |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |