EP2SGX30DF780I7N vs EP2SGX30DF780I3N 비교
다음의 상세 나란히 비교: EP2SGX30DF780I7N 제조: Intel 및 EP2SGX30DF780I3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2SGX30DF780I7N | EP2SGX30DF780I3N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $188.00 | $171.00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX (Enhanced Configuration / EPC) | Stratix II GX |
| Logic Elements | 33,880 LEs | 33,880 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 1,369,728 bits | — |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| Maximum User I/O | 586 user I/O pins | — |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps | — |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE | — |
| 패키지 | 780-ball FineLine BGA | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Core Voltage | 1.2 V (typical) | — |
| Process Technology | 90 nm | 90 nm CMOS |
| 동작 온도 | -40C to +100C (Industrial) | — |
| Speed Grade | 7 (fastest commercial speed grade) | I3 |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance] | Compliant |
| MSL 레벨 | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| Core Supply Voltage | — | 1.2 V |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |