EP2SGX60EF1152C3 vs EP2SGX60EF1152I3N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152C3 von Intel und EP2SGX60EF1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60EF1152C3 | EP2SGX60EF1152I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.210,00 | $1.195,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Multipliers (18x18) | 252 | — |
| Gehäuse | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (Commercial, C3 suffix) | — |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |