EP2SGX60EF1152C3 vs EP2SGX60EF1152I3N Сравнение
Подробное сравнение бок о бок EP2SGX60EF1152C3 от Intel и EP2SGX60EF1152I3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP2SGX60EF1152C3 | EP2SGX60EF1152I3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $2.210,00 | $1.195,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Multipliers (18x18) | 252 | — |
| Корпус | 1152-ball FC-FBGA (35 x 35 mm) | — |
| Тип монтажа | Surface Mount | Surface Mount (BGA) |
| Рабочая температура | 0C to +85C (Commercial, C3 suffix) | — |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Статус RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Уровень MSL | — | [DATA_NEEDED: MSL level] |