EP2SGX60EF1152C3 vs EP2SGX60EF1152I3N 对比
详细并排对比 EP2SGX60EF1152C3 出自 Intel 和 EP2SGX60EF1152I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152C3 | EP2SGX60EF1152I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,210.00 | $1,195.00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Multipliers (18x18) | 252 | — |
| 封装 | 1152-ball FC-FBGA (35 x 35 mm) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度 | 0C to +85C (Commercial, C3 suffix) | — |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | — | Stratix II GX |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | — | 60,440 |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |