EP3SL200H780I4 vs EP3SE260H780I4 Vergleich
Detaillierter Direktvergleich von EP3SL200H780I4 von Intel und EP3SE260H780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I4 | EP3SE260H780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.255,75 | $1.390,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III Enhanced (Stratix III E) |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | 10,200 |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | — |
| DSP Multipliers (18x18) | 384 | — |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | 4 |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 255,000 |
| Logic Cells | — | 255,000 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Gehäuse | — | 780-ball FC-HFBGA (HBGA) |
| Betriebstemperatur | — | -40C to +100C (industrial, 'I' grade) |
| Montageart | — | Surface Mount (BGA) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |