EP3SL200H780I4 vs EP3SE260H780I4 对比

详细并排对比 EP3SL200H780I4 出自 Intel 和 EP3SE260H780I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL200H780I4 EP3SE260H780I4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6,255.75 $1,390.00
Series Stratix III L —
Family Stratix III Stratix III Enhanced (Stratix III E)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 10,200
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) 4
工作结温 -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
RoHS 状态 Compliant [DATA_NEEDED: RoHS compliance status]
Design Tool Quartus II (legacy) / Quartus Prime —
Logic Elements — 255,000
Logic Cells — 255,000
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Core Voltage — 1.1 V
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Maximum Operating Frequency — up to 450 MHz core / 717 MHz per Partstack record
封装 — 780-ball FC-HFBGA (HBGA)
工作温度 — -40C to +100C (industrial, 'I' grade)
安装类型 — Surface Mount (BGA)
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

数据手册与资源

浏览全部产品 创建 BOM 获取报价