EPM5032DM vs EPM5032DI-20 Vergleich

Detaillierter Direktvergleich von EPM5032DM von Intel und EPM5032DI-20 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPM5032DM EPM5032DI-20
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $15,90 $8,75
Device Family MAX 5000 —
Macrocells 32 32
Propagation Delay (tPD) 25 ns —
Usable Gates 600 to 1000 (typical) —
Logic Inputs 32 —
Process Technology CMOS EEPROM —
Gehäuse CDIP-28 (ceramic windowed DIP, 28-pin) Ceramic DIP-20 (windowed, UV-erasable)
Supply Voltage (VCC) 5 V (typical) —
Standby Current [DATA_NEEDED: ICC standby current] —
Betriebstemperatur -55C to +125C (military/extended, ceramic package) Industrial (per 'I' suffix)
Programming Technology UV-erasable (windowed) EEPROM —
Logic Function Combinational and registered (synchronous) —
Output Polarity Programmable —
Program Retention Non-volatile (EEPROM) —
Montageart Through-hole (DIP) —
RoHS-Status Non-compliant (ceramic DIP with UV window) [DATA_NEEDED: RoHS compliance status for ceramic DIP variant]
Lead-Free No (ceramic DIP contains lead) [DATA_NEEDED: lead-free status]
Family — MAX 5000 (Altera legacy EPLD)
Architecture — CMOS PAL-type EPLD with PIA
Dedicated Inputs — 7
Bidirectional I/O Pins — 16
Product Terms — 320 (maximum)
Flip-Flops — 16 (one per macrocell)
Maximale Taktfrequenz — 62.5 MHz
Pin-to-Pin Delay — 20 ns (speed grade -20)
Programming — UV-erasable CMOS, JEDEC fuse file
Development Tool — Altera MAX+PLUS II (legacy)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern