M7AFS600-FG256I vs AFS600-FG256K Vergleich
Detaillierter Direktvergleich von M7AFS600-FG256I von Microchip Technology und AFS600-FG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ Aktiv
Spezifikationsvergleich
| Parameter | M7AFS600-FG256I | AFS600-FG256K |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Series | M7AFS600 (Fusion) | — |
| System Gates | 600K | 600,000 system gates |
| Logic Capacity (DigiKey listing) | 110592 | — |
| Number of I/O | 119 I/O | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Gehäuse / Bauform | 256-LBGA (FBGA) | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Montagestil | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | — |
| Programmable Logic Type | Flash-based, non-volatile | — |
| Analog Integration | Mixed-signal (configurable analog + flash memory) | — |
| Logic Cells | — | 13,824 logic cells |
| Device Type | — | Fusion mixed-signal FPGA |
| Programmable Logic | — | Flash-based CMOS programmable logic |
| Configuration Technology | — | Nonvolatile flash configuration |
| Power-Off Retention | — | Program retained when powered off |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Metal Layers | — | 7 metal layers |
| Logic Family | — | CMOS |
| Versorgungsspannung | — | 1.5 V |
| Betriebstemperaturbereich | — | 0°C to 70°C |
| Package Type | — | BGA-256, 1.0 mm pitch |
| Pin-Anzahl | — | 256 pins |
| Montageart | — | Surface mount |
| ARM Support | — | Optional ARM support in the Fusion family |