M7AFS600-FG256I vs AFS600-FG256K 比較

詳細並排比較 M7AFS600-FG256I 由 Microchip Technology 與 AFS600-FG256K 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 啟用中
Microchip Technology
AFS600-FG256K AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K ✓ 啟用中

規格比較

參數 M7AFS600-FG256I AFS600-FG256K
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M7AFS600 (Fusion) —
System Gates 600K 600,000 system gates
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
封裝 / 外殼 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安裝方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Logic Cells — 13,824 logic cells
Device Type — Fusion mixed-signal FPGA
Programmable Logic — Flash-based CMOS programmable logic
Configuration Technology — Nonvolatile flash configuration
Power-Off Retention — Program retained when powered off
Power-Up Behavior — Live at Power-Up (LAPU)
Metal Layers — 7 metal layers
Logic Family — CMOS
供應電壓 — 1.5 V
工作溫度範圍 — 0°C to 70°C
Package Type — BGA-256, 1.0 mm pitch
腳位數 — 256 pins
安裝類型 — Surface mount
ARM Support — Optional ARM support in the Fusion family

資料表與資源

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