M7AFS600-FG256I vs AFS600-FG256K 对比

详细并排对比 M7AFS600-FG256I 出自 Microchip Technology 和 AFS600-FG256K 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 量产中
Microchip Technology
AFS600-FG256K AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K ✓ 量产中

规格对比

参数 M7AFS600-FG256I AFS600-FG256K
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Series M7AFS600 (Fusion) —
System Gates 600K 600,000 system gates
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
封装 / 外壳 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安装方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Logic Cells — 13,824 logic cells
Device Type — Fusion mixed-signal FPGA
Programmable Logic — Flash-based CMOS programmable logic
Configuration Technology — Nonvolatile flash configuration
Power-Off Retention — Program retained when powered off
Power-Up Behavior — Live at Power-Up (LAPU)
Metal Layers — 7 metal layers
Logic Family — CMOS
电源电压 — 1.5 V
工作温度范围 — 0°C to 70°C
Package Type — BGA-256, 1.0 mm pitch
引脚数量 — 256 pins
安装类型 — Surface mount
ARM Support — Optional ARM support in the Fusion family

数据手册与资源

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