M7AFS600-FG256I vs AFS600-FG256K 비교

다음의 상세 나란히 비교: M7AFS600-FG256I 제조: Microchip Technology 및 AFS600-FG256K 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 활성
Microchip Technology
AFS600-FG256K AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K ✓ 활성

사양 비교

파라미터 M7AFS600-FG256I AFS600-FG256K
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
Series M7AFS600 (Fusion) —
System Gates 600K 600,000 system gates
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
패키지 / 케이스 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
장착 스타일 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Logic Cells — 13,824 logic cells
Device Type — Fusion mixed-signal FPGA
Programmable Logic — Flash-based CMOS programmable logic
Configuration Technology — Nonvolatile flash configuration
Power-Off Retention — Program retained when powered off
Power-Up Behavior — Live at Power-Up (LAPU)
Metal Layers — 7 metal layers
Logic Family — CMOS
공급 전압 — 1.5 V
동작 온도 범위 — 0°C to 70°C
Package Type — BGA-256, 1.0 mm pitch
핀 수 — 256 pins
실장 유형 — Surface mount
ARM Support — Optional ARM support in the Fusion family

데이터시트 & 자료

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