MC7448VU1000ND vs MC7448VU1400ND Vergleich
Detaillierter Direktvergleich von MC7448VU1000ND von NXP Semiconductors und MC7448VU1400ND von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MC7448VU1000ND ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC7448VU1000ND | MC7448VU1400ND |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $52,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 | — |
| Processor Type | MPC74xx PowerPC G4 32-Bit MPU | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 32-bit (64-bit MPX/60x bus) | — |
| Core Frequency | 1.0 GHz | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 1 MB unified on-chip | 1 MB unified, on-chip with ECC |
| SIMD Engine | AltiVec 128-bit vector unit | AltiVec (128-bit vector unit) |
| Core Voltage | 1.0 V (typical) | 1.15 V |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI |
| Bus Interface | MPX/60x, up to 200 MHz | — |
| Gehäuse | 360-FCCBGA (25x25 mm) flip-chip | 360-FCCBGA (Flip-Chip Ceramic BGA) 25 x 25 mm |
| Montageart | Surface Mount (BGA socket or reflow) | Surface Mount (BGA) |
| Betriebstemperatur | [DATA_NEEDED: full industrial temperature range] | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | Compliant (lead-free) |
| Packaging | Tray | — |
| Part Family | — | MPC7448 (PowerPC G4) |
| Core Architecture | — | PowerPC Power Architecture, 32-bit |
| Core Clock Speed | — | 1.4 GHz |
| Bus-to-Core Ratio | — | 7x |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| System Bus | — | MPX/60x |
| I/O Voltages | — | 1.5 V / 1.8 V / 2.5 V |
| Junction Temperature (TJ) | — | 0 °C to 105 °C |
| Number of Terminals | — | 360 |
| Package Code (JEDEC) | — | LGA-style, flip-chip ceramic BGA |
| Terminal Form | — | No-lead (flip-chip ball) |
| Temperature Grade | — | Other (extended commercial/industrial) |
| Bit Width | — | 32-bit |
| Product Lifecycle | — | Obsolete / End of Life |