MC7448VU1000ND vs MC7448VU1400ND Comparison
Detailed side-by-side comparison of MC7448VU1000ND by NXP Semiconductors and MC7448VU1400ND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MC7448VU1000ND ✗ End of LifeSpecification Comparison
| Parameter | MC7448VU1000ND | MC7448VU1400ND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $92.00 | $52.75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 | — |
| Processor Type | MPC74xx PowerPC G4 32-Bit MPU | — |
| Core Count | 1 | 1 |
| Data Bus Width | 32-bit (64-bit MPX/60x bus) | — |
| Core Frequency | 1.0 GHz | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 1 MB unified on-chip | 1 MB unified, on-chip with ECC |
| SIMD Engine | AltiVec 128-bit vector unit | AltiVec (128-bit vector unit) |
| Core Voltage | 1.0 V (typical) | 1.15 V |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI |
| Bus Interface | MPX/60x, up to 200 MHz | — |
| Package | 360-FCCBGA (25x25 mm) flip-chip | 360-FCCBGA (Flip-Chip Ceramic BGA) 25 x 25 mm |
| Mounting Type | Surface Mount (BGA socket or reflow) | Surface Mount (BGA) |
| Operating Temperature | [DATA_NEEDED: full industrial temperature range] | — |
| Lead Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | Compliant (lead-free) |
| Packaging | Tray | — |
| Part Family | — | MPC7448 (PowerPC G4) |
| Core Architecture | — | PowerPC Power Architecture, 32-bit |
| Core Clock Speed | — | 1.4 GHz |
| Bus-to-Core Ratio | — | 7x |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| System Bus | — | MPX/60x |
| I/O Voltages | — | 1.5 V / 1.8 V / 2.5 V |
| Junction Temperature (TJ) | — | 0 °C to 105 °C |
| Number of Terminals | — | 360 |
| Package Code (JEDEC) | — | LGA-style, flip-chip ceramic BGA |
| Terminal Form | — | No-lead (flip-chip ball) |
| Temperature Grade | — | Other (extended commercial/industrial) |
| Bit Width | — | 32-bit |
| Product Lifecycle | — | Obsolete / End of Life |