MC7448VU1000ND vs MC7448VU1400ND Comparación

Comparación detallada lado a lado de MC7448VU1000ND por NXP Semiconductors y MC7448VU1400ND por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC7448VU1000ND MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA

MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA

MC7448VU1000ND ✗ Fin de vida
NXP Semiconductors
MC7448VU1400ND MC7448VU1400ND - 1.4GHz PowerPC G4 MPU | NXP 360-FCCBGA

MC7448VU1400ND - 1.4GHz PowerPC G4 MPU | NXP 360-FCCBGA

MC7448VU1400ND Obsolete

Comparación de especificaciones

Parámetro MC7448VU1000ND MC7448VU1400ND
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Fin de vida Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $92,00 $52,75
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale)
Part Series MPC7448 —
Processor Type MPC74xx PowerPC G4 32-Bit MPU —
Core Count 1 1
Ancho del bus de datos 32-bit (64-bit MPX/60x bus) —
Core Frequency 1.0 GHz —
L1 Cache 32 KB instruction + 32 KB data —
L2 Cache 1 MB unified on-chip 1 MB unified, on-chip with ECC
SIMD Engine AltiVec 128-bit vector unit AltiVec (128-bit vector unit)
Core Voltage 1.0 V (typical) 1.15 V
Process Technology 90 nm Silicon-on-Insulator (SOI) 90 nm SOI
Bus Interface MPX/60x, up to 200 MHz —
Encapsulado 360-FCCBGA (25x25 mm) flip-chip 360-FCCBGA (Flip-Chip Ceramic BGA) 25 x 25 mm
Tipo de montaje Surface Mount (BGA socket or reflow) Surface Mount (BGA)
Temperatura de funcionamiento [DATA_NEEDED: full industrial temperature range] —
Lead Free Status Lead Free —
Estado RoHS RoHS Compliant Compliant (lead-free)
Packaging Tray —
Part Family — MPC7448 (PowerPC G4)
Core Architecture — PowerPC Power Architecture, 32-bit
Core Clock Speed — 1.4 GHz
Bus-to-Core Ratio — 7x
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
System Bus — MPX/60x
I/O Voltages — 1.5 V / 1.8 V / 2.5 V
Junction Temperature (TJ) — 0 °C to 105 °C
Number of Terminals — 360
Package Code (JEDEC) — LGA-style, flip-chip ceramic BGA
Terminal Form — No-lead (flip-chip ball)
Temperature Grade — Other (extended commercial/industrial)
Bit Width — 32-bit
Product Lifecycle — Obsolete / End of Life

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