MC7448VU1000ND vs MC7448VU1400ND Comparação
Comparação detalhada lado a lado de MC7448VU1000ND por NXP Semiconductors e MC7448VU1400ND por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MC7448VU1000ND ✗ Fim de vidaComparação de especificações
| Parâmetro | MC7448VU1000ND | MC7448VU1400ND |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $92,00 | $52,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 | — |
| Processor Type | MPC74xx PowerPC G4 32-Bit MPU | — |
| Core Count | 1 | 1 |
| Largura do barramento de dados | 32-bit (64-bit MPX/60x bus) | — |
| Core Frequency | 1.0 GHz | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 1 MB unified on-chip | 1 MB unified, on-chip with ECC |
| SIMD Engine | AltiVec 128-bit vector unit | AltiVec (128-bit vector unit) |
| Core Voltage | 1.0 V (typical) | 1.15 V |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI |
| Bus Interface | MPX/60x, up to 200 MHz | — |
| Encapsulamento | 360-FCCBGA (25x25 mm) flip-chip | 360-FCCBGA (Flip-Chip Ceramic BGA) 25 x 25 mm |
| Tipo de montagem | Surface Mount (BGA socket or reflow) | Surface Mount (BGA) |
| Temperatura de operação | [DATA_NEEDED: full industrial temperature range] | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | Compliant (lead-free) |
| Packaging | Tray | — |
| Part Family | — | MPC7448 (PowerPC G4) |
| Core Architecture | — | PowerPC Power Architecture, 32-bit |
| Core Clock Speed | — | 1.4 GHz |
| Bus-to-Core Ratio | — | 7x |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| System Bus | — | MPX/60x |
| I/O Voltages | — | 1.5 V / 1.8 V / 2.5 V |
| Junction Temperature (TJ) | — | 0 °C to 105 °C |
| Number of Terminals | — | 360 |
| Package Code (JEDEC) | — | LGA-style, flip-chip ceramic BGA |
| Terminal Form | — | No-lead (flip-chip ball) |
| Temperature Grade | — | Other (extended commercial/industrial) |
| Bit Width | — | 32-bit |
| Product Lifecycle | — | Obsolete / End of Life |