MPC8360ECVVAGDGA vs MPC8360ZUAGDGA Vergleich

Detaillierter Direktvergleich von MPC8360ECVVAGDGA von NXP Semiconductors und MPC8360ZUAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8360ECVVAGDGA MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA ✓ Aktiv
NXP Semiconductors
MPC8360ZUAGDGA MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA ✓ Aktiv

Spezifikationsvergleich

Parameter MPC8360ECVVAGDGA MPC8360ZUAGDGA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Processor Type PowerPC e300 Microprocessor IC MPC83xx PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro)
Core Architecture Power Architecture (PowerPC), 32-bit —
Number of Cores 1 —
Maximum Core Frequency 400 MHz —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 256 KB —
Memory Controller DDR1/DDR2 with ECC —
Ethernet MAC Gigabit Ethernet (10/100/1000) —
PCI Interface Yes (PCI 2.2) 32-bit / 66 MHz PCI
USB Interface USB 2.0 Full-Speed USB 2.0 Full-Speed
Security Engine Integrated SEC (IPsec/SSL acceleration) —
Communication Engine QUICC Engine with TDM/ATM/HDLC —
Operating Voltage (Core) 1.2 V —
Betriebstemperaturbereich -40C to +105C —
Gehäuse 740-TBGA (37.5 x 37.5 mm) —
Montageart Surface Mount (BGA) —
Lead-Free Status Lead-Free / RoHS compliant —
Silicon Revision 2.x (denoted by 'E' suffix) —
MSL-Level [DATA_NEEDED: MSL level] —
Core Count — 1
Architecture — 32-Bit Power Architecture
Core Clock Speed — 400 MHz
Core Voltage — 1.2 V
Gehäuse / Bauform — 740-LBGA / 740-TBGA (37.5 x 37.5 mm)
Packaging — Tray
Betriebstemperatur — 0 C to 105 C
Memory Interface — DDR1/DDR2 controller with ECC
Ethernet — 1 x 10/100/1000 (Gigabit Ethernet)
TDM / Serial — Multiple TDM channels (T1/E1/J1/HDLC/ATM)
Revision — Revision 2.x TBGA
Encryption — Non-encryption variant (no SEC 2.0)
RoHS-Status — Compliant
Lead Free Status — Lead Free

Datenblätter & Ressourcen

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