MPC8360ECVVAGDGA vs MPC8360ZUAGDGA Comparación
Comparación detallada lado a lado de MPC8360ECVVAGDGA por NXP Semiconductors y MPC8360ZUAGDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ ActivoComparación de especificaciones
| Parámetro | MPC8360ECVVAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Architecture | Power Architecture (PowerPC), 32-bit | — |
| Number of Cores | 1 | — |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | 32-bit / 66 MHz PCI |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | — |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| Rango de temperatura de funcionamiento | -40C to +105C | — |
| Encapsulado | 740-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Core Count | — | 1 |
| Architecture | — | 32-Bit Power Architecture |
| Core Clock Speed | — | 400 MHz |
| Core Voltage | — | 1.2 V |
| Encapsulado / Carcasa | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| Temperatura de funcionamiento | — | 0 C to 105 C |
| Memory Interface | — | DDR1/DDR2 controller with ECC |
| Ethernet | — | 1 x 10/100/1000 (Gigabit Ethernet) |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| Estado RoHS | — | Compliant |
| Lead Free Status | — | Lead Free |