MPC8360ECVVAGDGA vs MPC8360ZUAGDGA 비교

다음의 상세 나란히 비교: MPC8360ECVVAGDGA 제조: NXP Semiconductors 및 MPC8360ZUAGDGA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPC8360ECVVAGDGA MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA ✓ 활성
NXP Semiconductors
MPC8360ZUAGDGA MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA ✓ 활성

사양 비교

파라미터 MPC8360ECVVAGDGA MPC8360ZUAGDGA
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 활성
Processor Type PowerPC e300 Microprocessor IC MPC83xx PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro)
Core Architecture Power Architecture (PowerPC), 32-bit —
Number of Cores 1 —
Maximum Core Frequency 400 MHz —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 256 KB —
Memory Controller DDR1/DDR2 with ECC —
Ethernet MAC Gigabit Ethernet (10/100/1000) —
PCI Interface Yes (PCI 2.2) 32-bit / 66 MHz PCI
USB Interface USB 2.0 Full-Speed USB 2.0 Full-Speed
Security Engine Integrated SEC (IPsec/SSL acceleration) —
Communication Engine QUICC Engine with TDM/ATM/HDLC —
Operating Voltage (Core) 1.2 V —
동작 온도 범위 -40C to +105C —
패키지 740-TBGA (37.5 x 37.5 mm) —
실장 유형 Surface Mount (BGA) —
Lead-Free Status Lead-Free / RoHS compliant —
Silicon Revision 2.x (denoted by 'E' suffix) —
MSL 레벨 [DATA_NEEDED: MSL level] —
Core Count — 1
Architecture — 32-Bit Power Architecture
Core Clock Speed — 400 MHz
Core Voltage — 1.2 V
패키지 / 케이스 — 740-LBGA / 740-TBGA (37.5 x 37.5 mm)
Packaging — Tray
동작 온도 — 0 C to 105 C
Memory Interface — DDR1/DDR2 controller with ECC
Ethernet — 1 x 10/100/1000 (Gigabit Ethernet)
TDM / Serial — Multiple TDM channels (T1/E1/J1/HDLC/ATM)
Revision — Revision 2.x TBGA
Encryption — Non-encryption variant (no SEC 2.0)
RoHS 상태 — Compliant
Lead Free Status — Lead Free

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청