MPC8360ECVVAGDGA vs MPC8360ZUAGDGA 对比
详细并排对比 MPC8360ECVVAGDGA 出自 NXP Semiconductors 和 MPC8360ZUAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ 量产中规格对比
| 参数 | MPC8360ECVVAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Architecture | Power Architecture (PowerPC), 32-bit | — |
| Number of Cores | 1 | — |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | 32-bit / 66 MHz PCI |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | — |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| 工作温度范围 | -40C to +105C | — |
| 封装 | 740-TBGA (37.5 x 37.5 mm) | — |
| 安装类型 | Surface Mount (BGA) | — |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Core Count | — | 1 |
| Architecture | — | 32-Bit Power Architecture |
| Core Clock Speed | — | 400 MHz |
| Core Voltage | — | 1.2 V |
| 封装 / 外壳 | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| 工作温度 | — | 0 C to 105 C |
| Memory Interface | — | DDR1/DDR2 controller with ECC |
| Ethernet | — | 1 x 10/100/1000 (Gigabit Ethernet) |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| RoHS 状态 | — | Compliant |
| Lead Free Status | — | Lead Free |