MPC8360ECVVAGDGA vs MPC8360ZUAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8360ECVVAGDGA par NXP Semiconductors et MPC8360ZUAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ ActifComparaison des spécifications
| Paramètre | MPC8360ECVVAGDGA | MPC8360ZUAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) |
| Core Architecture | Power Architecture (PowerPC), 32-bit | — |
| Number of Cores | 1 | — |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | 32-bit / 66 MHz PCI |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | — |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| Plage de température de fonctionnement | -40C to +105C | — |
| Boîtier | 740-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount (BGA) | — |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Core Count | — | 1 |
| Architecture | — | 32-Bit Power Architecture |
| Core Clock Speed | — | 400 MHz |
| Core Voltage | — | 1.2 V |
| Boîtier / Format | — | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| Température de fonctionnement | — | 0 C to 105 C |
| Memory Interface | — | DDR1/DDR2 controller with ECC |
| Ethernet | — | 1 x 10/100/1000 (Gigabit Ethernet) |
| TDM / Serial | — | Multiple TDM channels (T1/E1/J1/HDLC/ATM) |
| Revision | — | Revision 2.x TBGA |
| Encryption | — | Non-encryption variant (no SEC 2.0) |
| Statut RoHS | — | Compliant |
| Lead Free Status | — | Lead Free |