MPX2010DP vs MPXC2011DT1 Vergleich
Detaillierter Direktvergleich von MPX2010DP von NXP Semiconductors und MPXC2011DT1 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ AktivSpezifikationsvergleich
| Parameter | MPX2010DP | MPXC2011DT1 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,50 | $14,95 |
| Sensortyp | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | Piezoresistive silicon strain gauge |
| Ausgangstyp | Analog voltage, Wheatstone bridge (mV level) | Analog Wheatstone bridge (ratiometric) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Versorgungsspannung | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | — |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| Betriebstemperatur | -40 °C to +125 °C | 0 °C to +85 °C |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| Pressure Type | — | Differential |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| Sensitivity | — | 2.5 mV/kPa typical |
| Excitation Voltage | — | 3 V DC to 10 V DC (10 V nominal) |
| Gehäuse | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Compensation | — | On-chip temperature compensated and calibrated |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |
| Montageart | — | Through-hole (PCB mount with side-port tubing) |