MPX2010DP vs MPXC2011DT1 Comparação
Comparação detalhada lado a lado de MPX2010DP por NXP Semiconductors e MPXC2011DT1 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ AtivoComparação de especificações
| Parâmetro | MPX2010DP | MPXC2011DT1 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Pressure Sensors | Pressure Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $8,50 | $14,95 |
| Tipo de sensor | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | Piezoresistive silicon strain gauge |
| Tipo de saída | Analog voltage, Wheatstone bridge (mV level) | Analog Wheatstone bridge (ratiometric) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Tensão de alimentação | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | — |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| Temperatura de operação | -40 °C to +125 °C | 0 °C to +85 °C |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| Pressure Type | — | Differential |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| Sensitivity | — | 2.5 mV/kPa typical |
| Excitation Voltage | — | 3 V DC to 10 V DC (10 V nominal) |
| Encapsulamento | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Compensation | — | On-chip temperature compensated and calibrated |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |
| Tipo de montagem | — | Through-hole (PCB mount with side-port tubing) |