MPX2010DP vs MPXC2011DT1 比較
詳細並排比較 MPX2010DP 由 NXP Semiconductors 與 MPXC2011DT1 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPX2010DP | MPXC2011DT1 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Pressure Sensors | Pressure Sensors |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 感測器類型 | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | Piezoresistive silicon strain gauge |
| 輸出類型 | Analog voltage, Wheatstone bridge (mV level) | Analog Wheatstone bridge (ratiometric) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| 供應電壓 | 10 V DC typical (max 16 V) | — |
| Linearity | ±0.05% (typ) | — |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| 工作溫度 | -40 °C to +125 °C | 0 °C to +85 °C |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status not in web data] |
| Pressure Type | — | Differential |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| Sensitivity | — | 2.5 mV/kPa typical |
| Excitation Voltage | — | 3 V DC to 10 V DC (10 V nominal) |
| 封裝 | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Compensation | — | On-chip temperature compensated and calibrated |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |
| 安裝類型 | — | Through-hole (PCB mount with side-port tubing) |