MRF6S19200HR5 vs MRFE6S9160HR3 Vergleich
Detaillierter Direktvergleich von MRF6S19200HR5 von NXP Semiconductors und MRFE6S9160HR3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MRF6S19200HR5 | MRFE6S9160HR3 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $89,75 | $25,20 |
| Transistortyp | LDMOS | N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | RF Power MOSFET | HV6E lateral MOSFET (LDMOS-like) |
| Drain-Source Voltage (Vds) Max | 66 V | — |
| Test Voltage (Vds) | 28 V | — |
| Test Current (Ids) | 1.6 A | — |
| Frequency Range | 1.93 GHz to 1.99 GHz | — |
| Power Gain (Typ) | 17.9 dB | — |
| Output Power (Pout) | 56 W (CW) | — |
| Gehäuse | NI-780H-2L (ceramic flange) | — |
| Montageart | Flange / Screw Mount | Chassis / Flange mount (through-hole RF leads) |
| Operating Mode | Class AB, Class C | — |
| Application | CDMA base station, multicarrier amplifiers | — |
| Input Matching | Internal (broadband) | — |
| Lead Free Status | Yes | — |
| RoHS-Status | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors |
| Drain-Source Voltage (V DSS) | — | 70 V (max) |
| Drain Current (continuous) | — | [DATA_NEEDED: typical drain current at TC=25C] |
| Operating Frequency Range | — | 865 MHz to 960 MHz |
| Test Frequency | — | 880 MHz |
| Drain Supply Voltage (V DD) | — | 28 V (typical) |
| Output Power (Average) | — | 35 W (single-carrier N-CDMA, 880 MHz) |
| Output Power (PEP) | — | [DATA_NEEDED: PEP at specified conditions] |
| Power Gain (G ps / G p) | — | 21 dB (typical at 880 MHz) |
| Drain Efficiency | — | 32.4% (typical, N-CDMA, 880 MHz) |
| Gehäuse / Bauform | — | NI-780H-2L (ceramic/metal air-cavity flange-mount) |
| Betriebstemperaturbereich | — | -40C to +150C (junction) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Thermal Resistance (R thJC) | — | [DATA_NEEDED: thermal resistance junction-to-case] |
| Input Match | — | Internally matched input (broadband) |
| Lead-Free | — | Yes |
| MSL-Level | — | Not applicable (non-SMD air-cavity package) |