MRF7S21080HR3 vs MRF7S21080HSR3 Vergleich
Detaillierter Direktvergleich von MRF7S21080HR3 von NXP Semiconductors und MRF7S21080HSR3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MRF7S21080HR3 | MRF7S21080HSR3 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,95 | $71,50 |
| Transistortyp | LDMOS, N-Channel Enhancement-Mode | Lateral N-Channel RF Power MOSFET |
| Technology | RF Power Field Effect Transistor (lateral MOSFET) | Lateral MOSFET, enhancement-mode |
| Frequency Band | 2110 MHz to 2170 MHz | — |
| Test Frequency | 2.11 GHz to 2.17 GHz | 2167.5 MHz |
| Rated Drain Voltage | 65 V | — |
| Test Supply Voltage (VDD) | 28 V | — |
| Quiescent Current (IDQ) | 800 mA | — |
| Output Power (Avg, W-CDMA) | 22 W Avg. | — |
| Power Gain | 18 dB | 18 dB |
| Drain Efficiency (typical) | 32 % | — |
| ACPR @ 5 MHz Offset | -38 dBc in 3.84 MHz channel | — |
| Output Signal PAR | 6.5 dB at 0.01% CCDF | — |
| Input Signal PAR | 7.5 dB at 0.01% CCDF | — |
| Channel Bandwidth | 3.84 MHz | 3.84 MHz |
| Gehäuse | NI-780S-4S2S (NI-780, 3-pin ceramic, flange mount) | NI-780S (NI-780HS) ceramic-metal sealed |
| Montageart | Surface Mount / Flange Mount | Surface Mount |
| Application | CDMA / W-CDMA / LTE base-station power amplifiers | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MRF7S21080HSR3 |
| Operating Frequency | — | 2110 MHz to 2170 MHz |
| Drain-Source Voltage (VDS max) | — | 65 V |
| Operating Drain Voltage (VDD) | — | 28 V |
| Quiescent Drain Current (IDQ) | — | 800 mA |
| Output Power (Average, W-CDMA) | — | 22 W |
| Drain Efficiency | — | 32% |
| ACPR at 5 MHz Offset | — | -38 dBc |
| Device Output Signal PAR | — | 6.5 dB at 0.01% CCDF |
| Configuration | — | Single |
| Terminal Form | — | Flat |
| Package Body Material | — | Ceramic, metal-sealed cofired |
| Lead-Free | — | Yes |
| RoHS-Status | — | Compliant (per NXP product page) |