MRF7S21150HSR3 vs MRF7S16150HSR3 Vergleich
Detaillierter Direktvergleich von MRF7S21150HSR3 von NXP Semiconductors und MRF7S16150HSR3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MRF7S21150HSR3 - 28V 44W RF Power LDMOS, 2110-2170 MHz | NXP
MRF7S21150HSR3 ObsoleteSpezifikationsvergleich
| Parameter | MRF7S21150HSR3 | MRF7S16150HSR3 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Transistortyp | N-Channel LDMOS RF Power MOSFET | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET |
| Frequency Band | 2110 MHz to 2170 MHz | — |
| Test Voltage | 28 V | — |
| Rated Drain Voltage (Vds max) | 65 V | — |
| Average Output Power | 44 W (W-CDMA) | — |
| Peak Output Power | 150 W | — |
| Power Gain | 17.5 dB (typical at 2.14 GHz) | 19.7 dB |
| Test Current | 1.35 A | — |
| Gehäuse | NI-780S (NI-780 HS variant) | — |
| Configuration | Single, push-pull final stage | Single (SINGLE) |
| Montageart | Flange / bolt-down with ceramic body | Surface Mount / bolt-down flange |
| Lead Configuration | High-source-leads (HS) variant | — |
| Operating Mode | Class AB / Doherty | — |
| Application | W-CDMA, LTE base station final-stage PA | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| JEDEC Qualification | JESD22 thermal/mechanical | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Technology | — | RF Power Field-Effect Transistor (HV7 process) |
| Drain-Source Voltage (VDS) Rated | — | 65 V minimum |
| Drain-Source Voltage (Test Condition) | — | 28 V typical operating |
| Continuous Drain Current | — | 1.5 A |
| Operating Frequency Range | — | 1.6 GHz to 1.66 GHz |
| Test Frequency | — | 1.6 GHz |
| Output Power (Pout) | — | 32 W |
| Gehäuse / Bauform | — | NI-780S (ceramic, metal-sealed cofired, surface mount) |
| Case Connection | — | SOURCE (flange tied to source) |
| Channel Temperature (Tch max) | — | [DATA_NEEDED: maximum channel temperature] |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Lead / Terminal Finish | — | [DATA_NEEDED: lead finish / plating] |