SPC5643LFF2MMM1R vs SPC5645SF1VVU Vergleich
Detaillierter Direktvergleich von SPC5643LFF2MMM1R von NXP Semiconductors und SPC5645SF1VVU von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ AktivSpezifikationsvergleich
| Parameter | SPC5643LFF2MMM1R | SPC5645SF1VVU |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,85 | $27,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | Power Architecture e200z4d (dual-core lockstep option) |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| Betriebstemperaturbereich | -40 °C to +125 °C (automotive grade) | -40 C to +105 C |
| Gehäuse | 257-LFBGA / MAPBGA 14x14 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | Yes (Automotive Grade) |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | JTAG / Nexus 5001 (Level 3 trace) |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Versorgungsspannung | — | 3.3 V / 5 V tolerant I/O |
| Gehäuse / Bauform | — | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| RoHS-Status | — | Compliant |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |