SPC5643LFF2MMM1R vs SPC5645SF1VVU Comparación
Comparación detallada lado a lado de SPC5643LFF2MMM1R por NXP Semiconductors y SPC5645SF1VVU por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ ActivoNXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActivoComparación de especificaciones
| Parámetro | SPC5643LFF2MMM1R | SPC5645SF1VVU |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,85 | $27,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | Power Architecture e200z4d (dual-core lockstep option) |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C (automotive grade) | -40 C to +105 C |
| Encapsulado | 257-LFBGA / MAPBGA 14x14 mm | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | Yes (Automotive Grade) |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | JTAG / Nexus 5001 (Level 3 trace) |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| Ancho del bus de datos | — | 32-bit |
| Frecuencia de reloj máxima | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| Tensión de alimentación | — | 3.3 V / 5 V tolerant I/O |
| Encapsulado / Carcasa | — | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| Estado RoHS | — | Compliant |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |