SPC5643LFF2MMM1R vs SPC5645SF1VVU Comparação

Comparação detalhada lado a lado de SPC5643LFF2MMM1R por NXP Semiconductors e SPC5645SF1VVU por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Ativo
NXP Semiconductors
SPC5645SF1VVU SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU ✓ Ativo

Comparação de especificações

Parâmetro SPC5643LFF2MMM1R SPC5645SF1VVU
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $24,85 $27,10
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) Power Architecture e200z4d (dual-core lockstep option)
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
Faixa de temperatura de operação -40 °C to +125 °C (automotive grade) -40 C to +105 C
Encapsulamento 257-LFBGA / MAPBGA 14x14 mm —
Tipo de montagem Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) Yes (Automotive Grade)
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) JTAG / Nexus 5001 (Level 3 trace)
Lead-Free / RoHS Compliant (lead-free BGA) —
Largura do barramento de dados — 32-bit
Frequência máxima de clock — 125 MHz
Program Memory Size — 2 MB Flash
Program Memory Type — Flash with ECC
SRAM Size — [DATA_NEEDED: SRAM size in KB]
Tensão de alimentação — 3.3 V / 5 V tolerant I/O
Encapsulamento / Caixa — 416-PBGA (27x27 mm, 1.0 mm pitch)
Functional Safety — Targeting ASIL-D (dual-core lockstep)
CAN Controllers — Dual CAN 2.0B (FlexCAN)
FlexRay — Yes, dual-channel FlexRay module
Ethernet — [DATA_NEEDED: Ethernet MAC availability]
Graphics Accelerator — Yes, integrated GFXPU for TFT cluster
ADC — 12-bit ADC, multi-channel
Timers — eMIOS unified channels
Status RoHS — Compliant
Process Technology — 90 nm CMOS
JEDEC MSL — MSL3 (per PBGA JEDEC J-STD-020)

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