SPC5643LFF2MMM1R vs SPC5645SF1VVU 비교
다음의 상세 나란히 비교: SPC5643LFF2MMM1R 제조: NXP Semiconductors 및 SPC5645SF1VVU 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | SPC5643LFF2MMM1R | SPC5645SF1VVU |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $24.85 | $27.10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MPC5643L (MPC56xx Qorivva family) | — |
| Core Architecture | Power Architecture® e200z4 (dual-core with delayed lockstep) | Power Architecture e200z4d (dual-core lockstep option) |
| Core Count | 2 (1 main + 1 lockstep checker) | — |
| Maximum CPU Clock | 120 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| Data Memory (SRAM) | [DATA_NEEDED: SRAM size] | — |
| Operating Voltage Range | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] | — |
| 동작 온도 범위 | -40 °C to +125 °C (automotive grade) | -40 C to +105 C |
| 패키지 | 257-LFBGA / MAPBGA 14x14 mm | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive qualified per NXP product page) | Yes (Automotive Grade) |
| Functional Safety Target | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) | — |
| Communication Interfaces | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) | — |
| Debug Interface | Nexus (JTAG, auxiliary) | JTAG / Nexus 5001 (Level 3 trace) |
| Lead-Free / RoHS | Compliant (lead-free BGA) | — |
| 데이터 버스 폭 | — | 32-bit |
| 최대 클록 주파수 | — | 125 MHz |
| Program Memory Size | — | 2 MB Flash |
| Program Memory Type | — | Flash with ECC |
| SRAM Size | — | [DATA_NEEDED: SRAM size in KB] |
| 공급 전압 | — | 3.3 V / 5 V tolerant I/O |
| 패키지 / 케이스 | — | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| Functional Safety | — | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | — | Dual CAN 2.0B (FlexCAN) |
| FlexRay | — | Yes, dual-channel FlexRay module |
| Ethernet | — | [DATA_NEEDED: Ethernet MAC availability] |
| Graphics Accelerator | — | Yes, integrated GFXPU for TFT cluster |
| ADC | — | 12-bit ADC, multi-channel |
| Timers | — | eMIOS unified channels |
| RoHS 상태 | — | Compliant |
| Process Technology | — | 90 nm CMOS |
| JEDEC MSL | — | MSL3 (per PBGA JEDEC J-STD-020) |