XC6SLX75-3FGG484C vs XC6SLX75-3FG484I Vergleich
Detaillierter Direktvergleich von XC6SLX75-3FGG484C von AMD und XC6SLX75-3FG484I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX75-3FGG484C | XC6SLX75-3FG484I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Unknown |
| Device Type | Field Programmable Gate Array (FPGA) | FPGA |
| Series | Spartan-6 LX | — |
| Logic Cells | 74,637 | 74,637 cells |
| User I/O Count | 280 | — |
| Package Type | 484-ball FBGA (MS-034) | — |
| Package Body Size | 23 x 23 mm | — |
| Package Pitch | 1.0 mm | 1 mm |
| Internal Clock Frequency | 667 MHz | — |
| Speed Grade | -3 (highest performance in Spartan-6 LX family) | -3 highest-performance family grade |
| Betriebstemperaturbereich | 0 °C to 85 °C (commercial grade) | — |
| Montageart | Surface Mount (SMD) | Surface mount |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | 1.2 V |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP48A slice count] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards per bank] | — |
| Manufacturer | AMD (formerly Xilinx) | — |
| RoHS-Status | unknown | [DATA_NEEDED: RoHS status] |
| Order Code Suffix | C = commercial temperature grade | — |
| FPGA Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Process Technology | — | 45 nm CMOS |
| User I/O | — | 280 I/O |
| Internal Frequency | — | 667 MHz |
| Catalog Maximum Frequency | — | 862 MHz |
| Temperature Grade | — | Industrial |
| Betriebstemperatur | — | 0°C to 85°C (32°F to 185°F) |
| Gehäuse | — | FBGA-484 |
| Package Dimensions | — | 23 mm × 23 mm |
| Terminal Count | — | 484 balls |
| REACH Status | — | [DATA_NEEDED: REACH status] |