XC6SLX75-3FGG484C vs XC6SLX75-3FG484I 对比
详细并排对比 XC6SLX75-3FGG484C 出自 AMD 和 XC6SLX75-3FG484I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-3FGG484C | XC6SLX75-3FG484I |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| Device Type | Field Programmable Gate Array (FPGA) | FPGA |
| Series | Spartan-6 LX | — |
| Logic Cells | 74,637 | 74,637 cells |
| User I/O Count | 280 | — |
| Package Type | 484-ball FBGA (MS-034) | — |
| Package Body Size | 23 x 23 mm | — |
| Package Pitch | 1.0 mm | 1 mm |
| Internal Clock Frequency | 667 MHz | — |
| Speed Grade | -3 (highest performance in Spartan-6 LX family) | -3 highest-performance family grade |
| 工作温度范围 | 0 °C to 85 °C (commercial grade) | — |
| 安装类型 | Surface Mount (SMD) | Surface mount |
| 电源电压 | [DATA_NEEDED: supply voltage range] | 1.2 V |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP48A slice count] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards per bank] | — |
| Manufacturer | AMD (formerly Xilinx) | — |
| RoHS 状态 | unknown | [DATA_NEEDED: RoHS status] |
| Order Code Suffix | C = commercial temperature grade | — |
| FPGA Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 5,831 CLBs |
| Process Technology | — | 45 nm CMOS |
| User I/O | — | 280 I/O |
| Internal Frequency | — | 667 MHz |
| Catalog Maximum Frequency | — | 862 MHz |
| Temperature Grade | — | Industrial |
| 工作温度 | — | 0°C to 85°C (32°F to 185°F) |
| 封装 | — | FBGA-484 |
| Package Dimensions | — | 23 mm × 23 mm |
| Terminal Count | — | 484 balls |
| REACH Status | — | [DATA_NEEDED: REACH status] |