10AS048H2F34I1HG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
Référence : 10AS048H2F34I1HG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3488.37 | $3 488,37 |
| 10 | $3295 | $32 950,00 |
| 100 | $2980 | $298 000,00 |
| 500 | $2750 | $1 375 000,00 |
| 1 000 | $2520 | $2 520 000,00 |
10AS048H2F34I1HG Présentation
A SoC FPGA (System-on-Chip FPGA) is a device that integrates a general-purpose processor subsystem with programmable logic on a single die, allowing hardware accelerators, custom peripherals, and DSP blocks to be tightly coupled to a running operating system. The Arria 10 SX family belongs to Intel's mid-range SoC FPGA portfolio, sitting between the lower-power Cyclone V SoC and the high-performance Stratix 10 SoC devices. Within that family the Arria 10 SX integrates the HPS (ARM Cortex-A9 dual-core with NEON, L1/L2 caches, and peripheral controllers) alongside an FPGA fabric optimized for DSP and transceiver-heavy designs.
Key features include 480K logic elements, 28.6 Mbits of embedded memory, up to 1.5 GHz fabric operation, integrated transceivers (up to 24 channels at 17.4 Gbps), variable-precision DSP blocks, and the hardened HPS with rich peripheral set including USB, EMAC, NAND, SD/SDIO, SPI, I2C, and UART controllers. The 1152-ball FCBGA package supports 492 user I/O pins operating from 0.9 V to 3.3 V LVCMOS/LVDS interfaces. The industrial temperature rating (I1 = -40C to 100C) enables deployment in harsh-environment and outdoor embedded systems.
The device is fabricated on TSMC's 20 nm process, giving a favorable performance-per-watt ratio for DSP-intensive workloads. Integrated transceivers, hard PCIe Gen2/Gen3 IP, and dedicated DDR4/DDR3 memory controllers simplify board design by removing external PHY ICs. The combination of HPS + FPGA fabric plus industrial-grade operation makes it a frequent choice for defense, broadcast, medical imaging, and industrial machine-vision platforms.
Typical applications include software-defined radio (SDR) baseband processing, broadcast video encoders/decoders, industrial machine-vision and video inspection, radar and electronic-warfare signal processing, 5G fronthaul digital pre-distortion, and embedded ARM-Linux controller boards with FPGA acceleration.
When designing with this OPN, engineers should review the Arria 10 SX transceiver reference designs, the HPS pin-mux configuration in Platform Designer, and the Quartus Prime power-estimator early in the schematic phase. The F34 (35x35 mm) 1152-FBGA package requires a multilayer PCB with microvia stack-up; signal-integrity and power-integrity simulations are recommended for SERDES channels above 10 Gbps.
This page synthesizes distributor pricing, same-family drop-in OPN alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 10AS048H2F34I1HG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS048H2F34I1HG (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Mounting Type, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS048H1F34I1HG
✅ Remplacement direct✓ En stock
$2650 / unité
Voir la fiche technique →10AS048H2F34E1HG
✅ Remplacement direct✓ En stock
$3650 / unité
Voir la fiche technique →10AS048H2F34E2SG
✅ Remplacement direct✓ En stock
$3120 / unité
Voir la fiche technique →10AS048H2F34E2LG
✅ Remplacement direct✓ En stock
$2280 / unité
Voir la fiche technique →10AS048H1F34E1HG
✅ Remplacement direct✓ En stock
$3048.91 / unité
Voir la fiche technique →10AS048H2F34I1HG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | 1.5 GHz |
| Boîtier | 1152-FBGA, FC (35x35 mm) |
| User I/O Pins | 492 |
| Transceivers | Up to 24 channels |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Speed Grade | H2 |
| Temperature Grade | Industrial (I1), -40C to 100C |
| Process Technology | 20 nm TSMC |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| I/O Standard Support | LVCMOS / LVDS / LVTTL up to 3.3 V |
Configuration des broches de 10AS048H2F34I1HG
| Broche 1 | BALL_A1 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 2 | BALL_A2 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 3 | BALL_A3 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 4 | BALL_A4 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 5 | BALL_A5 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 6 | BALL_A6 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 7 | BALL_A7 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 8 | BALL_A8 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 9 | BALL_A9 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 10 | BALL_A10 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 11 | BALL_A11 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 12 | BALL_A12 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 13 | BALL_B1 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 14 | BALL_B2 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 15 | BALL_B3 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 16 | BALL_B4 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 17 | BALL_B5 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 18 | BALL_B6 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 19 | BALL_B7 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
| Broche 20 | BALL_B8 — Package ball; refer to Arria 10 F34 pin connection guidelines for function |
Applications typiques
10AS048H2F34I1HG convient pour 6 applications: Software-Defined Radio (SDR) Baseband, Broadcast Video Encoder/Decoder, Industrial Machine Vision & Video Inspection, Radar and Electronic-Warfare Signal Processing, 5G Fronthaul Digital Pre-Distortion (DPD), Embedded ARM-Linux Controller with FPGA Acceleration.
Software-Defined Radio (SDR) Baseband
The 10AS048H2F34I1HG fits SDR baseband processing because its dual ARM Cortex-A9 HPS runs the real-time OS and protocol stack while the FPGA fabric executes wideband DDC/DUC, channelization, and FFT kernels. With up to 24 transceivers at 17.4 Gbps, the same die can host multi-band RF aggregation for cellular, defense, or airborne SDRs; the industrial -40C to 100C grade supports outdoor and vehicular deployments. Companion parts include the AD9361 RF transceiver, HMC7044 clock generator, and DDR3/LPDDR3 memory for waveform buffers.
Recommandé
Broadcast Video Encoder/Decoder
Broadcast 4K/UHD video codecs and contribution encoders benefit from the 10AS048H2F34I1HG's 480K logic elements plus variable-precision DSP for HEVC/H.264 motion estimation and deblocking filtering. The HPS runs the transport stream, scrambling, and IP/ASI mux while the FPGA fabric handles real-time video processing at 60 fps. The 1152-FBGA F34 package provides the 492 user I/Os needed for multiple SDI/HDMI/DisplayPort interfaces. Companion parts include the ADV7511 HDMI transmitter, M25P flash for boot, and Ethernet PHYs for IP transport.
Recommandé
Industrial Machine Vision & Video Inspection
The 10AS048H2F34I1HG's parallel logic resources and DSP blocks accelerate industrial machine-vision pipelines: image rectification, color-space conversion, defect detection, and CNN inference at line rates. The industrial temperature range (-40C to 100C) supports factory-floor and outdoor installations, while the HPS can run Linux with GigE Vision drivers and OPC-UA connectivity. With 24 transceivers, multiple CoaXPress or GigE Vision cameras can be aggregated. Companion parts include PoE+ controllers, image sensors, and DDR4 memory for high-throughput buffering.
Recommandé
Radar and Electronic-Warfare Signal Processing
The 10AS048H2F34I1HG is suited for radar and EW systems where wide instantaneous bandwidth and high throughput matter; the 24 transceivers up to 17.4 Gbps handle A/D data capture while the 480K logic elements plus DSP blocks run pulse compression, CFAR detection, and jammer cancellation in real time. The hardened HPS hosts Linux for situational-awareness software and tracks the operator interface. Industrial temperature grade supports airborne, shipboard, and ground-vehicle platforms. Companion parts include the AD9208 wideband ADC, HMC830 PLL, and signal-conditioning amplifiers.
Recommandé
5G Fronthaul Digital Pre-Distortion (DPD)
In 5G massive-MIMO and fronthaul links, the 10AS048H2F34I1HG runs wideband DPD and CFR (crest-factor reduction) on the FPGA fabric while the HPS handles CPRI/eCPRI MAC, Ethernet, and management. Up to 24 transceivers support multi-radio aggregation and the variable-precision DSP blocks accelerate matrix inversions and LUT updates. The industrial temperature range covers outdoor radio units. Companion parts include the AD9371 transceiver, PoE controllers, and PTP/SyncE clock devices for fronthaul timing.
Recommandé
Embedded ARM-Linux Controller with FPGA Acceleration
The 10AS048H2F34I1HG is an excellent choice for industrial controllers that must combine a full Linux operating system on the HPS with custom FPGA accelerators - for example, deterministic real-time EtherCAT motion controllers, predictive-maintenance vibration processors, or factory-edge AI gateways. The HPS runs Linux + Docker with OPC-UA, MQTT, and TLS; the FPGA handles high-speed I/O (EtherCAT, Profinet, RS-485) and time-critical DSP. Industrial temperature grade enables deployment in unshielded enclosures. Companion parts include the TPS7A4701 LDO, Ethernet PHYs, and industrial flash.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS048H2F34I1HG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS048H1F34I1HG | 10AS048H2F34E1HG | 10AS048H2F34E2SG | 10AS048H2F34E2LG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 480K | 480K - same | 480K - same | 480K - same | 480K - same | 480K - same |
| Speed Grade | H2 | H1 (slower) | H2 - same | H2 - same | H2 - same | H1 (slower) |
| Temperature Grade | Industrial -40C to 100C (I1) | Industrial -40C to 100C (I1) | Enhanced 0C to 100C (E1) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E2) | Enhanced 0C to 100C (E1) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Industrial temperature grade (-40C to 100C) with H2 speed (vs 10AS048H2F34E1HG)
- Highest H2 speed grade within the 10AS048 F34 industrial family (vs 10AS048H1F34I1HG)
- 1152-ball FCBGA package supports maximum transceiver count (vs 10AS048H2F34E1HG)
Notes de conception
The 1152-ball FCBGA (35x35 mm) F34 package has a relatively high theta_JB (junction-to-board) of approximately 0.5 C/W and theta_JC (junction-to-case) of 0.05 C/W; designers MUST mount the exposed die-attached pad over a high-layer-count PCB with a thermal via array under the package center to dissipate up to ~20 W of fabric + HPS power. Recommended stack-up is 12+ layers with continuous inner-plane copper under the BGA and a heat sink or top-side heat-spreader for industrial deployments above 8 W total power. Estimated: at 15 W dissipation and 70 C/W theta_JA, junction rises 150 C above ambient; refer to Quartus Prime Power Analyzer early in the design.
The 35x35 mm 1152-FBGA F34 package requires microvia (laser-drilled) stack-up with 1 mm or 0.8 mm pitch escape routing; do NOT attempt 0.5 mm-pitch fan-out without 0.1 mm microvias. Per Intel pin connection guidelines, 0.4 mm-pitch escape is recommended. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) must be placed within 2 mm of the BGA on the BOTTOM side to minimize inductance. Power-plane cuts under the BGA can cause simultaneous switching noise (SSN); keep at least 0.5 mm clearance and stitch with GND vias every 2-3 mm.
Three common pitfalls with the 10AS048H2F34I1HG: (1) do NOT omit MSEL configuration-pin pull resistors - incorrect MSEL setting will prevent configuration; (2) when designing HPS boot, ensure JTAG pins (TCK, TMS, TDI, TDO) are correctly pulled to known logic levels to prevent HPS entering test mode; (3) DDR3/DDR4 routes to the HPS must be length-matched within the stringent tDS/tDH budgets in Quartus Prime - use the DDR pin-macro assignments tool. Also be aware that transceiver reference clocks must be AC-coupled with 100 nF capacitors at the XCVR pins, otherwise CDR locking will fail.
Informations de conformité
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable (FPGA, not automotive discrete). Halogen-free status not explicitly confirmed in verified data. Conflict-minerals compliance inferred from Intel supply-chain program.
