10AS057H4F34I3LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
Teilenummer: 10AS057H4F34I3LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2710 | $27.100,00 |
| 100 | $2560 | $256.000,00 |
| 500 | $2410 | $1.205.000,00 |
| 1.000 | $2280 | $2.280.000,00 |
10AS057H4F34I3LG Übersicht
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field Programmable Gate Array) is a heterogeneous device that integrates a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The category hierarchy is: SoC FPGA -> FPGA -> programmable logic -> semiconductor IC. SoC FPGAs differ from traditional FPGAs by including deterministic hardware processing (ARM cores) alongside reconfigurable logic, enabling single-chip solutions for compute-intensive applications such as motor control, software-defined radio, video processing, and industrial Ethernet.
Key features include 570K logic elements, embedded DDR3/DDR4 memory controllers with hard PHY, multi-gigabit transceivers, programmable fractional PLLs, and the CoreSight debug fabric shared between the HPS and FPGA domains. The industrial temperature grade (-40C to +100C for SoC) and BGA package with 35x35 mm footprint suit embedded industrial platforms with rigorous thermal and mechanical requirements.
Architecturally, the 10AS057H4F34I3LG pairs an ARM Cortex-A9 dual-core MPCore HPS block with the Arria 10 Adaptive Logic Module (ALM)-based FPGA fabric. The HPS includes dedicated L1/L2 caches, NEON media engine, and on-chip RAM, while the FPGA fabric contains DSP blocks, M20K SRAM blocks, and variable-precision DSP, all linked through AXI/ACP bridges that allow zero-copy data transfer between the two domains.
Typical applications include industrial motor drives, software-defined radio baseband, medical imaging pipelines, smart grid / substation automation, and embedded vision systems. The combination of deterministic ARM execution with parallel FPGA acceleration is particularly suited to real-time control loops where latency budgets are tight.
When designing with this part, ensure PCB layout follows Intel's pin connection guidelines, especially for transceiver reference clocks and HPS DDR3/4 channels. Plan thermal management: industrial temperature SoCs typically require a 4-6 layer PCB with dedicated copper pours. Use Quartus Prime Pro for synthesis, place-and-route, and HPS firmware toolchain.
This page synthesizes distributor pricing, same-family drop-in alternatives, SoC FPGA design notes, and a parameter comparison not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AS057H4F34I3LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS057H4F34I3LG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Logic Elements, Operating Temperature, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS057H4F34E3LG
✅ Drop-In✓ Auf Lager
$1820 / Stück
Datenblatt ansehen →10AS057H3F34I2LG
✅ Drop-In✓ Auf Lager
$2950 / Stück
Datenblatt ansehen →10AS057H3F34I2SG
✅ Drop-In✓ Auf Lager
$2290 / Stück
Datenblatt ansehen →10AS057H2F34I2LG
✅ Drop-In✓ Auf Lager
$3675 / Stück
Datenblatt ansehen →10AS057H2F34E2LG
✅ Drop-In✓ Auf Lager
$2524.1 / Stück
Datenblatt ansehen →10AS048H4F34I3LG
✅ Drop-In✓ Auf Lager
$3920 / Stück
Datenblatt ansehen →10AS048H4F34E3LG
✅ Drop-In✓ Auf Lager
$2295 / Stück
Datenblatt ansehen →10AS057H4F34I3LG Grenzwerte & elektrische Eigenschaften
| Product Type | SoC FPGA (System-on-Chip FPGA) |
| Series | Arria 10 SX |
| Family | 10AS057 |
| Logic Elements | 570,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Number of Logic Cells | 570,000 |
| Number of I/O | 492 |
| Gehäuse | 1152-FBGA, FC (35x35 mm) |
| Package Code | BGA, F34 |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Temperature Grade | Industrial |
| RoHS-Status | Compliant |
| Supply Form | Tray |
| Architecture | FPGA + Hard Processor System (HPS) |
10AS057H4F34I3LG bga, f34 Pinbelegungsleitfaden
Pinbelegung für 10AS057H4F34I3LG (bga, f34-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS057H4F34I3LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS057H4F34I3LG ist geeignet für 6 Anwendungs: Industrial Motor Control and Drives, Software-Defined Radio (SDR) Baseband, Medical Imaging and Diagnostics, Smart Grid and Substation Automation, Embedded Vision and Machine Learning Inference, Aerospace and Defense Avionics.
Industrial Motor Control and Drives
The 10AS057H4F34I3LG is ideal for multi-axis industrial servo drives and field-oriented control (FOC) motor controllers. Its 570K logic elements provide ample fabric for parallel current-loop calculation at PWM rates above 100 kHz, while the Dual ARM Cortex-A9 HPS runs speed/torque loops, position control, and CAN/EtherCAT communication stacks. The 1.5 GHz HPS frequency ensures deterministic control loop execution under microsecond-level deadlines. Used as the central controller on the drive PCB, it replaces separate MCU + FPGA two-chip solutions. The -40C to +100C industrial temperature range supports cabinet-mounted drives in factories. Unlike pure-FPGA approaches, the integrated HPS eliminates external processor-to-FPGA handshake latency for sub-microsecond control loops.
Empfohlen
Software-Defined Radio (SDR) Baseband
The 10AS057H4F34I3LG serves as the digital baseband processor in software-defined radio systems, handling channelization, FFT, modulation/demodulation, and protocol stack processing. Its 570K logic elements and abundant DSP blocks accelerate polyphase filter banks and OFDM FFTs at line rate, while the HPS runs network protocol layers, packet processing, and system management. Multi-gigabit transceivers interface directly to RF ADCs/DACs. Placed on the baseband PCB between the RF front-end and the host network processor, it performs real-time signal processing at sample rates above 200 MSPS. Unlike a discrete DSP + processor, the unified SoC FPGA architecture eliminates shared-memory bottlenecks and reduces PCB area in size-constrained SDR modules for tactical and commercial wireless systems.
Empfohlen
Medical Imaging and Diagnostics
The 10AS057H4F34I3LG is used in medical imaging systems such as ultrasound beamformers, CT image reconstruction pipelines, and MRI data acquisition. Its parallel fabric executes real-time beamforming, FIR filtering, and image reconstruction at 60+ fps, while the ARM HPS handles user interface, DICOM networking, and patient data management. The industrial temperature range supports imaging cart deployments in clinical environments. Positioned as the primary compute engine on the imaging board, it interfaces to analog front-ends via LVDS or JESD204B links. Unlike GPU-based imaging systems, the SoC FPGA provides deterministic latency required for real-time diagnostic workflows and meets medical device deterministic-timing requirements.
Empfohlen
Smart Grid and Substation Automation
The 10AS057H4F34I3LG enables IEC 61850-compliant substation equipment including merging units, protection relays, and phasor measurement units (PMUs). Its hardened ARM cores run communication stacks (MMS, GOOSE, SV) while the FPGA fabric executes parallel protective algorithms at sub-millisecond response times. Industrial temperature grade and long-term availability suit utility-grade deployment lifecycles. Integrated as the central processor on the IED (Intelligent Electronic Device) mainboard, it replaces discrete MCU + DSP combinations. The HPS handles secure communications and cyber-security, while the FPGA performs fast analog input sampling and trip decision logic. This architecture reduces BOM and improves determinism vs traditional architectures.
Empfohlen
Embedded Vision and Machine Learning Inference
The 10AS057H4F34I3LG accelerates convolutional neural network (CNN) inference and image processing pipelines in industrial vision systems. The FPGA fabric executes quantized CNN layers via parallel MAC arrays, while the HPS runs the application layer, camera interface, and decision logic. With 570K logic elements, it can host multiple CNN models for object detection and classification at edge. Used as the AI inference engine on smart-camera PCBs, it processes 1080p video streams at 30+ fps for defect detection and quality inspection. Unlike cloud-based ML inference, the SoC FPGA enables real-time edge inference with no network latency, critical for high-throughput production lines.
Empfohlen
Aerospace and Defense Avionics
The 10AS057H4F34I3LG powers avionics subsystems including flight control computers, radar processing, and electronic warfare systems. Its 570K logic elements support complex radar waveform generation and DSP processing, while the hardened ARM Cortex-A9 HPS runs flight-critical software with deterministic response. Multi-gigabit transceivers enable high-speed sensor data aggregation. Deployed on conduction-cooled boards in avionics bays, it handles MIL-STD-1553, ARINC 429, and Ethernet avionics bus interfaces. Unlike pure software processors, the SoC FPGA architecture provides the deterministic parallel processing required for safety-critical flight control loops and radar signal processing at multi-MHz rates.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS057H4F34I3LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS057H4F34E3LG | 10AS057H3F34I2LG | 10AS057H3F34I2SG | 10AS057H2F34I2LG | 10AS057H2F34E2LG | 10AS048H4F34I3LG | 10AS048H4F34E3LG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same |
| Temperature Grade | Industrial (-40C to +100C) | Extended/Commercial | Industrial | Industrial | Industrial | Extended/Commercial | Industrial | Extended/Commercial |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Higher logic density than 10AS048H4F34I3LG (vs. 10AS048H4F34I3LG)
- Industrial temperature grade option (vs. 10AS057H4F34E3LG)
- SoC architecture eliminates external processor (vs. Discrete FPGA + external ARM MCU)
Designhinweise
The 1152-FBGA package requires a 4-6 layer PCB with microvia technology and 1 oz copper power planes. Per Intel pin connection guidelines, all VCCINT and VCCIO pins must be decoupled with 0.1uF and 10uF ceramic capacitors placed within 100 mils of the respective BGA balls. Use a 35x35 mm BGA land pattern with 0.8 mm or 1.0 mm pitch. HPS DDR3/4 channels require impedance-controlled routing with 50 ohm single-ended / 100 ohm differential traces and matched-length constraints.
Estimated: At full fabric utilization (570K LE, ~85% toggle rate) and 1.5 GHz HPS activity, the 10AS057H4F34I3LG dissipates approximately 15-20W. The FC-FBGA package requires thermal vias under the central die area and a heatsink with thermal interface material rated for industrial temperature. Use the Intel PowerPlay Early Power Estimator (EPE) tool with Quartus Prime to obtain accurate power estimates for your design. Conduction cooling is recommended for sealed industrial enclosures.
Critical configuration gotchas: (1) HPS boot mode pins (BSEL) must be set correctly for the chosen boot source (SD card, QSPI flash, or NAND); incorrect settings will cause the HPS to fail to boot. (2) The HPS and FPGA fabric share configuration pins via the CoreSight debug fabric - incorrectly routing the HPS JTAG pins can lock out both domains. (3) Transceiver reference clocks must meet the jitter requirements specified in the Arria 10 Transceiver User Guide, typically requiring a jitter cleaner PLL.
Separate HPS and FPGA power domains must be isolated per Intel's power tree guidelines. HPS requires a dedicated 0.9V core supply with ±3% tolerance and a separate 1.8V/3.3V I/O supply. The FPGA fabric VCCINT, VCCPT, VCCAUX, and VCCIO supplies must ramp in the correct sequence to prevent latch-up. Place HPS reset and POR circuits adjacent to the HPS power pins to minimize noise coupling.
Compliance-Informationen
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is a SoC FPGA, not an automotive-grade IC. Industrial temperature grade (-40C to +100C) suitable for industrial applications.
